Off-resonance three-dimensional elliptical diamond vibration cutting method and device

A vibration cutting and diamond technology, applied in the direction of automatic control devices, feeding devices, auxiliary devices, etc., can solve the problems that affect the processing accuracy, non-adjustable, crosstalk, etc., and achieve the effect of precise control, easy precise control, and precise fine-tuning

Active Publication Date: 2013-11-20
HUAWEI TEHCHNOLOGIES CO LTD
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Problems solved by technology

[0005] The currently widely used EVC drive belongs to the resonance type, which is characterized by a high vibration frequency. The existing literature shows that the maximum can reach 60KHZ, mainly because two distributed loads are applied on both sides of the tool rod by piezoelectric means. According to non- The principle of linear superharmonic resonance makes the tip of the tool generate a two-dimensional elliptical motion trajectory, but the two-dimensional EVC currently seen generally has the following disadvantages: (1) The nonlinear superharmonic resonance of the tool holder is in the transverse bending vibration and longitudinal vibration There is coupling on the
(2) The frequency of elliptical vibration cannot be adjusted due to the constant natural mode shape of the cutter bar, which makes it difficult to adapt to the processing requirements of different processing materials
(3) The node of the tool holder clamping is obtained by analyzing the vibration mod

Method used

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  • Off-resonance three-dimensional elliptical diamond vibration cutting method and device
  • Off-resonance three-dimensional elliptical diamond vibration cutting method and device
  • Off-resonance three-dimensional elliptical diamond vibration cutting method and device

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Embodiment Construction

[0033] A non-resonant three-dimensional elliptical diamond vibration cutting method is as follows:

[0034] The four parallel piezoelectric stacks 1 1201, 2 piezoelectric stack 1202, 3 piezoelectric stack 1203, and 4 piezoelectric stack 1204 are respectively driven by the input driving signal, and the driving signal is: The four piezoelectric stacks respectively push the first push surface 405, the second push surface 406, the third push surface 407, and the fourth push surface 408 on the hinge base 4 of the knife seat, so that the hinge one 401, the hinge two 402, the hinge three 403, the hinge 404 generates micro-displacement for guidance, and when there is a phase difference between the phase angles of the four piezoelectric stack drive signals, an adjustable three-dimensional elliptical motion trajectory of the diamond tool tip point of the diamond tool 3 is obtained. The trajectory can be actively adjusted through the frequency, amplitude, and phase difference of the dri...

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Abstract

The invention relates to an off-resonance three-dimensional elliptical diamond vibration cutting method and device and belongs to a cutting method and device. Four piezoelectric stacks which are placed in parallel are driven according to input signals, and phase angles of the input signals are different in a two-to-two mode. The piezoelectric stacks push a pushing face on a tool apron hinge base body to enable various hinges to produce micrometric displacement, therefore a diamond cutter point three-dimensional elliptical movement track capable of being adjusted can be obtained, the track can be adjusted initiatively through frequency, amplitudes and phase differences of driving signals of the piezoelectric stacks and installation positions of the piezoelectric stacks. The off-resonance three-dimensional elliptical diamond vibration cutting method and device can meet requirements for various difficult-to-machine materials and different face types through diamond cutting, and obtains the best cutting machining performance.

Description

technical field [0001] The invention belongs to the technical field of ultra-precision cutting and complex optical parts processing of difficult-to-machine materials, and in particular relates to a non-resonant three-dimensional elliptical vibration cutting method and device. Background technique [0002] In recent years, with the rapid development of industrial fields such as aerospace and national defense, the demand for ultra-precision machining of optical and electronic components is also increasing. However, due to the limitations of some high-performance but difficult-to-machine materials, traditional diamond cutting The method is difficult to meet the requirements due to the rapid tool wear. [0003] On this basis, One-Dimensional Ultrasonic Vibration Cutting (1D UVC), also known as traditional vibration cutting, has been successfully applied to the cutting of some difficult-to-machine materials since 1966, but there are still some defects, such as surface roughness l...

Claims

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Application Information

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IPC IPC(8): B23B1/00B23B25/00B23Q15/007B23Q15/22
Inventor 周晓勤卢明明林洁琼张旭
Owner HUAWEI TEHCHNOLOGIES CO LTD
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