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An automatic integrated circuit packaging system injection molding mechanism

A packaging system and integrated circuit technology, which is applied in the field of automatic integrated circuit (IC) resin injection molding mechanism, can solve the problems of flashing and imprinting of plastic packaging products, and achieve the effects of quick replacement, improved cost performance, and convenient debugging

Active Publication Date: 2016-05-18
TONGLING FUSHI SANJIA MACHINE
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  • Abstract
  • Description
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Problems solved by technology

[0006] The technical problem to be solved by the present invention is to solve the problem that the movement of the injection molding mechanism of the IC packaging equipment is stuck during the resin heating and flowing stage, and the uneven injection pressure leads to flashes and marks on the plastic sealing product, that is, to provide a method for preventing the movement of the injection molding mechanism from being stuck and injection molding. Injection mechanism with uneven pressure

Method used

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  • An automatic integrated circuit packaging system injection molding mechanism
  • An automatic integrated circuit packaging system injection molding mechanism

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Embodiment Construction

[0013] The content of the present invention will be described in detail below with reference to the accompanying drawings. In this specification, for the convenience of description, the direction pointing to the end where the product and the exchange part of the injection molding mechanism are fixed is called up, and the opposite direction is called down.

[0014] When the injection molding machine is working, the AC servo motor (not marked in the figure) drives the injection screw 1 to move up and down through the synchronous belt and the synchronous pulley. The lifting seat 2 is fixed on the injection screw 1 by bolts. There are a pair of copper alloy self-lubricating bearings in the guide post holes 11 on both sides of the lift seat 2, and the lift seat 2 can move up and down along the bearings through the guide post holes 11 on the edge.

[0015] In order to improve the quality of the injection molded product, the material of the base plate 3 of the lift seat is chromium-...

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Abstract

The invention relates to an injection moulding mechanism for integrated circuit (hereinafter referred to as IC) packaging. The injection moulding mechanism comprises an injection moulding screw (1), an elevating seat (2), an elevating seat base plate (3), a positioning pin (4), a through hole (5), a through hole (6), a circle helical spring (7), a positioning block (8), a connecting board C (9), load sensors (10), and a guide pillar hole (11). The upper surface of the elevating seat base plate (3) contacts with the exchange portion of the injection moulding mechanism, the upper surface of the elevating seat (2) takes the geometric center of the elevating seat (20 as the center, two load sensors (10) are symmetrically embedded into the upper face of the elevating seat, and one of the load sensors (10) is fixedly connected to the lower surface of the elevating seat base plate (3). In this structure, when the injection moulding machine works, the load sensors (10) can measure the injection mould pressure of the exchange portion of the injection moulding mechanism and give feedbacks to the driver to control the injection moulding pressure.

Description

technical field [0001] The invention relates to a mechanism for automatic integrated circuit (IC) resin injection molding, in particular to an injection molding mechanism when an integrated circuit (hereinafter referred to as IC) is plastic-sealed by a packaging device. Background technique [0002] IC packaging refers to the process of connecting circuit pins on a silicon chip to external connectors with wires for connection with other devices. In the process of IC packaging, an injection molding machine is generally used to plasticize the integrated circuit (hereinafter referred to as IC) by using thermosetting materials. Injection molding machine is also known as injection molding machine or injection molding machine. it is resin [0003] Or the main molding equipment for thermosetting materials to be made into various shapes of plastic products through molding dies. Divided into vertical, horizontal, all-electric. [0004] The working process of the injection molding...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C45/77B29C45/46
Inventor 汪洋陈昌太赵仁家刘永
Owner TONGLING FUSHI SANJIA MACHINE
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