Mobile phone chip shielding structure and mobile phone

A mobile phone chip and shielding structure technology, applied in the direction of telephone structure, cooling/ventilation/heating transformation, etc., can solve the problems of large chip pressure and unstable heat dissipation effect, and achieve the effect of ensuring effective transmission

Inactive Publication Date: 2013-11-20
HUIZHOU TCL MOBILE COMM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to provide a mobile phone chip shielding structure and a mobile phone, aiming to solve the problem of unstable heat dissipation or excessive pressure on the chip caused by the assembly of the current mobile phone shielding structure

Method used

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  • Mobile phone chip shielding structure and mobile phone
  • Mobile phone chip shielding structure and mobile phone

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Embodiment Construction

[0014] The present invention provides a mobile phone chip shielding structure and a mobile phone. In order to make the purpose, technical solution and effect of the present invention clearer and clearer, the present invention will be further described in detail below. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0015] Such as figure 2 The mobile phone chip shielding structure shown, its cover is arranged on the top of mobile phone chip 220, and described mobile phone chip 220 is arranged on the PCB board 210, and the upper surface of described mobile phone chip 220 is mounted with thermal pad 250, and the outer side of described shielding structure Mounted with a heat sink 260, wherein the mobile phone chip shielding structure includes a shielding cover 240 and a shielding clip 230 for clamping and fixing the shielding cover, the shielding clip 230 is arranged on the...

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Abstract

The invention discloses a mobile phone chip shielding structure and a mobile phone. The mobile phone chip shielding structure comprises a shielding cover and a shielding clamp used for clamping and fixing the shielding cover, wherein the shielding clamp is arranged on a PCB (printed circuit board), and the shielding cover is clamped and fixed through the shielding clamp and abutted against a heat conducting gasket on a mobile phone chip. According to the mobile phone chip shielding structure and the mobile phone provided by the invention, a connection mode of the shielding cover is changed into adjustable splicing from fixed connection through using the shielding clamp, thereby enabling the shielding cover to be effectively contacted with the heat conducting gasket on the chip, ensuring effective transmission of heat, and guaranteeing a problem that the performance of the mobile phone is influenced because the chip is compressed by the shielding cover not to occur.

Description

technical field [0001] The invention relates to the field of mobile terminal equipment, in particular to a mobile phone chip shielding structure and a mobile phone. Background technique [0002] With the continuous popularization of smart phones, the competition among different manufacturers is becoming more and more fierce. Due to the serious homogeneity, the "arms" competition between different brands in terms of hardware is also intensifying. The processor has changed from single-core, dual-core, to the current quad-core; the resolution of the display screen has also been rising all the way. The problem of natural heat dissipation is also becoming more and more serious. The mobile phone chip needs to be equipped with a shielding structure and an auxiliary heat dissipation structure at the same time. Currently, the commonly used mobile phone shielding structure is as follows: figure 1 As shown, the shielding cover 140 and the shielding frame 130 form a shielding structur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04M1/02H05K7/20
Inventor 鲁林海刘鑫
Owner HUIZHOU TCL MOBILE COMM CO LTD
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