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MEMS (micro electro mechanical system) double-layer film unit out-of-plane curvature testing structure

A technology of double-layer film and test structure, which is applied in the direction of mechanical counter/curvature measurement, etc., can solve problems such as stress difference, and achieve the effect of stable test process, low test equipment requirements, and stable test parameter values

Inactive Publication Date: 2013-11-27
SOUTHEAST UNIV
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Problems solved by technology

The stress difference or stress gradient can be calculated from the radius of curvature

Method used

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  • MEMS (micro electro mechanical system) double-layer film unit out-of-plane curvature testing structure
  • MEMS (micro electro mechanical system) double-layer film unit out-of-plane curvature testing structure
  • MEMS (micro electro mechanical system) double-layer film unit out-of-plane curvature testing structure

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Embodiment Construction

[0028] The following description is merely exemplary in nature and is not intended to limit the disclosure, application, or uses. It should be understood that throughout the drawings, corresponding reference numerals indicate like or corresponding parts and features.

[0029] Attached below Figures 1 to 4 The present invention will be further described.

[0030] The invention proposes a test structure for the off-plane bending curvature of a microelectromechanical double-layer thin film unit. like figure 1 As shown, the test structure consists of two left and right double-layer thin-film gate structures 101 and a differential vernier 102 placed opposite each other.

[0031] The differential vernier 102 consists of two parts: left and right. The core structure of the left half of the differential vernier is a "T" type structure, and the core structure of the right half is a "convex" type structure. Each "T"-shaped head has a certain alignment relationship with the two adj...

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Abstract

The invention provides an MEMS (micro electro mechanical system) double-layer film unit out-of-plane curvature testing structure. A measuring unit consists of two double-layer film portal structures and an error measuring cursor, wherein the two double-layer film portal structures are left and right double-layer film portal structures in opposite arrangement, the error measuring cursor consists of a left part and a right part, the double-layer film portal structures consist of an anchor region and two straight beams and are formed through overlapping an upper layer film material and a lower layer film material, one end of the straight beam is connected with the anchor region, the other end of the straight beam of the left double-layer film portal structure is connected with the straight beam of the left half part of the error measuring cursor, and the other end of the straight beam of the right double-layer film portal structure is connected with the straight beam of the right half part of the error measuring cursor. The simple double-layer film portal structure is utilized, in addition, the error measuring cursor is matched, the out-of-plane curvature of double-layer films formed by the MEMS common-use film materials can be obtained, in addition, the structure can be popularized to the testing under the condition of film materials with more layers, and a measuring method and a parameter extraction calculation method are very simple.

Description

technical field [0001] The invention provides a test structure for off-plane bending curvature of a micro-electromechanical double-layer thin film unit, which belongs to the technical field of micro-electromechanical system (MEMS) material parameter testing. Background technique [0002] The performance of MEMS devices is closely related to the material parameters. Due to the influence of the processing process, some material parameters will change. These uncertain factors caused by the processing technology will make the device design and performance prediction uncertain and unstable. Case. [0003] Thin-film materials are widely used in the fabrication of MEMS device structures, especially in surface micro-mechanical structures. Thin-film materials are the main material of the structural material, usually produced by chemical vapor deposition (CVD) or physical vapor deposition (PVD). For example, silicon nitride, polysilicon, silicon dioxide, metal layers, and the like. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B5/20
Inventor 李伟华王雷张晓强张璐周再发孙超
Owner SOUTHEAST UNIV
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