Production method of integrated multilayer lighting set

Abstract

The invention provides a production method of an integrated multilayer lighting set. A base can be integrally formed. A lighting unit made by a proper processing method can be disposed directly in the base. The lighting unit can be packaged in a chamber of the base just when a lens cover is fitted to the chamber. Therefore, a plurality of packaging steps can be omitted, and the whole production process can be simplified. The base is made of metal material which is excellent in heat conduction. Compared with the prior art using packaging materials of plastic material, the method has the advantages that the usage of packaging materials is reduced greatly and radiating efficiency can be improved effectively.

Description

Technical field [0001] The invention relates to a manufacturing method of a lighting device, in particular to a manufacturing method of an integrated multi-layer lighting device. Background technique [0002] The light-emitting principle of LED is based on the inherent characteristics of semiconductors. It is different from the principle of discharge and heating of the previous incandescent tube. Instead, it emits light when the current flows into the PN junction of the semiconductor. Therefore, the LED is called a cold light source. . Because LED has the advantages of high durability, long life, light weight, low power consumption and no mercury and other harmful substances, it can be widely used in the lighting equipment industry, and it is usually applied in electronic billboards, Commercial areas such as traffic signs. [0003] Please refer to Taiwan New Patent Publication No. M387375, which relates to a multi-layer array type light emitting diode package structure, which mai...

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Problems solved by technology

[0004] However, the disadvantage of the prior art is that packaging materials are used to make packaging modules when packaging each light-emitting diode, but the packaging materials are mostly made of plastic resin, but the heat dissipation capacity of general plastic resin is far inferior to that of metal materials, and the heat dissipation capacity is insufficient. It will seriously affect the service life and luminous efficiency of light-emitting diodes, and the metal substrate and packaging module cannot be fabricated in one piece, resulting in complicated production steps. Therefore, the above shortcomings must be improved to greatly improve heat conduction efficiency and reduce the use of packaging materials.

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