Device and method for coating adhesion agents on bonding pads of PCB (printed circuit board) of LED (light-emitting diode) area light source

Abstract

The invention belongs to the technical field of LED (light-emitting diode) area light sources, and particularly relates to a device and a method for coating adhesion agents on bonding pads of a PCB (printed circuit board) of an LED (light-emitting diode) area light source. The device for coating the adhesion agents on the bonding pads of the PCB of the LED area light source comprises a steel screen pasted on the PCB and a wiping and scraping device, wherein through holes corresponding to the bonding pads of the PCB are formed in the steel screen; the wiping and scraping device is used for wiping and scraping on the steel screen. When the adhesion agents are coated on the bonding pads of the PCB, the steel screen is pasted on the PCB, and the through holes of the steel screen correspond to the bonding pads of the PCB; then the adhesion agents are placed on the steel screen, then the wiping and scraping device is used for wiping and scraping on the steel screen, and the adhesion agents are filled in the through holes of the steel screen; then the steel screen is removed, and at the same time, the adhesion agents filled in the through holes are pasted and attached to the bonding pads of the PCB, thereby completing the arrangement of the adhesion agents on the bonding pads of the PCB. The device for coating the adhesion agents on the bonding pads of the PCB of the LED area light source provided by the invention has the advantages of simple structure, low cost, high efficiency and the like.

Description

technical field [0001] The invention belongs to the technical field of LED surface light sources, and in particular relates to a device and a method for coating an adhesive on a pad of a PCB of an LED surface light source. Background technique [0002] At present, the LED surface light source is generally used as the backlight source in the direct-type backlight module. When the LED surface light source is manufactured, a plurality of pads are regularly arranged on the PCB, and then a plurality of LED chips are mounted on the regular arrangement on the PCB. Since the light emitted by the LED chip is divergent, in order to change the light path of the light emitted by the LED chip and make the light parallel to the light, it is necessary to mount a lens on the LED chip. The lens is generally a plastic lens; in addition, The lens is also mounted on the pad where the LED chip is located. In order to make the lens firmly mounted on the pad, it is necessary to set an adhesive on ...

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a method for coating adhesive on the pads of the PCB of the LED surface light source, aiming to solve the problem of high cost in the existing method of dispensing glue on the pads of the PCB of the LED surface light source by using a glue dispenser. , the problem of low efficiency

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