A control method of wet etching process

Abstract

The invention relates to a control method of a wet etching process. The control method of the wet etching process comprises the steps that a product needing to be processed by the wet etching process is provided; according to data information of the product and parameter information of the wet etching process, process conditions of the wet etching process for the product are obtained; according to the parameter information of the wet etching process, a corresponding etching device containing an etching solution is selected; use condition data of the etching solution are obtained through the etching device; whether the use condition data are suitable for the process conditions or not is judged, so that whether the wet etching process is conducted on the product or not is determined. The control method can control the wet etching process of the product, avoid the situation that the wet etching process is conducted on the product on the condition that the etching solution does not meet the etching conditions, and further improve the stability and reliability of the wet etching process.

Description

technical field [0001] The invention relates to a semiconductor process control method, in particular to a wet etching process control method. Background technique [0002] As a product requiring high precision, a semiconductor device has an impact on the performance of the device in any error during its production process, which is especially reflected in today's increasingly complex integrated circuit devices. Therefore, it is necessary to control the process links in the production process of semiconductors. [0003] The wet etching process is a very common process method in the semiconductor manufacturing process, and it exists in large quantities in today's semiconductor manufacturing process. Wet etching equipment needs to be used in the wet etching process. The current commonly used wet etching equipment usually uses two indicators of life cycle (Life time) and the number of processed products (Wafer count) to measure the wet etching process. Whether the etching sol...

AI Technical Summary

Problems solved by technology

This utility model can realize the supporting use of new wet etching equipment with the old medicine cabinet, eliminating the problems of daily maintenance and replacement of spare parts for the newly purchased medicine cabinet during use, but it does not solve the above-mentioned problems for general Technical issues on the storage time of wet etching solution determined by products and special products

[0007] It can be seen that there is currently no method for finely controlling the wet etching solution

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