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LED chip and its preparation method

A technology of LED chips and core particles, applied in electrical components, circuits, semiconductor devices, etc., can solve problems such as loss of light-emitting area and oblique cracks, and achieve the effects of increasing light-emitting area, maintaining costs, and improving optoelectronic performance.

Active Publication Date: 2016-03-16
JUCAN PHOTOELECTRIC TECH (SUQIAN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] When splitting the core, the stealth laser cutting acts on the middle of the substrate, and it is easy to cause oblique cracks when splitting. In order to keep the chip surface intact, the N-type isolation trench between chips must have a certain width, which will lose a large part Light emitting area

Method used

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  • LED chip and its preparation method
  • LED chip and its preparation method
  • LED chip and its preparation method

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Embodiment Construction

[0038] In order to make those skilled in the art better understand the technical solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described The embodiments are only some of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0039] Furthermore, repeated reference numbers or designations may be used in different embodiments. These repetitions are for simplicity and clarity of description of the present invention and do not represent any association between the different embodiments and / or structures discussed.

[0040] The invention discloses ...

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Abstract

The invention discloses a light-emitting diode (LED) chip and a manufacturing method thereof. The LED chip comprises a substrate, a semiconductor epitaxial layer located on the substrate, a transparent conductive layer located on the semiconductor epitaxial layer, a P electrode located on the transparent conductive layer and an N electrode on the semiconductor epitaxial layer, wherein all of or a part of side walls of the semiconductor epitaxial layer and the substrate are set to be continuous oblique planes. Under the condition that the overall size of the chip is not increased, the light-emitting area of the chip is increased through design improvement. In addition, additional process steps are not increased, the original cost is maintained, and the photoelectric property of the chip is improved.

Description

technical field [0001] The present invention relates to the technical field of semiconductor light-emitting devices, in particular to an LED chip and a preparation method thereof. Background technique [0002] Light-Emitting Diode (LED) is a semiconductor electronic component that emits light. This electronic component appeared as early as 1962. In the early days, it could only emit red light with low luminosity. Later, other versions of monochromatic light were developed. Today, the light that can be emitted has spread to visible light, infrared light and ultraviolet light, and the luminosity has also increased to a certain level. luminosity. And the use has also been used as indicator lights, display panels, etc. at the beginning; with the continuous advancement of technology, light-emitting diodes have been widely used in monitors, TV lighting decoration and lighting. [0003] The LED chip manufacturing process is as follows: [0004] An undoped semiconductor layer, an...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/36H01L33/14H01L33/00
Inventor 陈家洛吴飞翔陈立人余长治
Owner JUCAN PHOTOELECTRIC TECH (SUQIAN) CO LTD