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Electronic module and method for the production thereof

A technology for electronic modules and electronic components, which is applied in semiconductor/solid-state device manufacturing, circuits, electrical components, etc., can solve the problems of expensive overall structure of electronic modules, and achieve the effect of improving cooling efficiency and compact cooler structure

Active Publication Date: 2013-12-18
ROBERT BOSCH GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In this respect, this arrangement needs to be improved, as it is desirable that the cooling medium is not guided inside the electronics module, since this would make the overall construction of the electronics module very expensive

Method used

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  • Electronic module and method for the production thereof
  • Electronic module and method for the production thereof
  • Electronic module and method for the production thereof

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Embodiment Construction

[0019] Refer below Figures 1 to 4 A particularly preferred embodiment of the electronic module 1 according to the invention is described in detail.

[0020] figure 1 The arrangement is shown in the exemplary case of four electronic modules, all electronic modules being represented by reference number 1 . The electronics module 1 is arranged in a corresponding recess 18 of the cooler housing 14 . In this example case, the cooler housing 14 is a housing using cooling water as a cooling medium. In principle, however, the electronics module 1 according to the invention can also be combined with other cooling media, such as in particular cooling air.

[0021] The following details are based on Figure 2 to Figure 4 The electronics module 1 described seals off the cutout 18 in this embodiment, so that apart from its actual function as an electronic component, for example a measuring sensor, the cutout 18 can also be sealed against the escape of cooling water 15 without further ...

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Abstract

The invention relates to an electronic module (1) comprising a carrier plate (2), at least one electronic component (3, 4), which is arranged on the carrier plate (2), and a molded housing (5), which encases the carrier plate (2) and the at least one electronic component (3, 4), wherein the carrier plate (2) has a central region (6).

Description

technical field [0001] The invention relates to an electronic module, eg for a transmission control system of a vehicle, and to a method for producing the electronic module. Background technique [0002] An electronic module in the form of a printed circuit board is known from DE 10 2006 007 303 A1, which in one embodiment has a heat-conducting element which is a cooling coil molded into the casting cover element and which conducts a cooling medium. In this case, the cooling coil preferably extends with multiple bends in a plane parallel to the plane of the printed circuit board, within the largest available space in the casting cover element. To this extent, this arrangement requires improvement, as it is desirable that the cooling medium is not guided within the electronics module, since this would make the overall construction of the electronics module very expensive. Contents of the invention [0003] In contrast, an electronic module according to the invention with t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56H01L23/13H01L23/36H01L23/31
CPCH01L21/56H01L23/13H01L23/3121H01L23/36H01L23/4006H01L23/473H01L2924/0002H01L2924/00
Inventor T·卡登P·莱通恩T·贝伦斯
Owner ROBERT BOSCH GMBH
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