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Injection molding method and injection molding device

A technology of injection molding and mould, applied in the direction of coating, etc., can solve the problem of insufficient cooling of the mold surface 64, etc., and achieve the effect of less defective appearance

Active Publication Date: 2014-01-15
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

which is, Image 6 The mold arrangement shown cannot sufficiently cool the mold surface 64 using only the heating and cooling circuits 65 disposed near the mold surface 64

Method used

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  • Injection molding method and injection molding device
  • Injection molding method and injection molding device
  • Injection molding method and injection molding device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0046] figure 1 It is a side sectional view of main parts showing a structural example of the injection molding die apparatus of Embodiment 1. FIG. This injection molding die device is configured to be able to implement the injection molding simultaneous transfer sheet method (Japanese: Injection molding simultaneous foil printing method). Specifically, this injection molding mold device is configured to obtain a molded article by injecting molten resin (engineering resin) into a molding space (cavity) of an injection molding mold, and to place multiple components disposed in the cavity. The transfer layer of the film is transferred onto the surface (transfer surface) of the molded article. Hereinafter, this injection molding die device will be described in detail.

[0047] Such as figure 1 As shown, this injection molding die set includes a movable side mold 11 which is an example of a first mold, and a fixed side mold 12 which is an example of a second mold. Generally, s...

Embodiment approach 2

[0077] Below, refer to Figure 4 , Embodiment 2 will be described focusing on matters different from those described in Embodiment 1 above. Figure 4 It is a schematic plan view showing a configuration example of the concave cavity forming surface 11 a of the movable side mold 11 according to the second embodiment. in addition, Figure 4 Parts not shown in FIG. 1 are the same as those in Embodiment 1 above, and therefore descriptions of these parts are omitted.

[0078] In the second embodiment, as Figure 4 As shown, the bottom surface of the concave cavity forming surface 11a of the movable side mold 11 is rectangular, and the four corners 11b of the bottom surface are curved portions (curved surfaces) having a curvature radius. Therefore, the annular side surface connected to the bottom surface also has four straight parts and four corner parts connecting the four straight parts in plan view, and these four corner parts are curved parts (curved surfaces).

[0079] In th...

Embodiment approach 3

[0086] Below, refer to Figure 5 , Embodiment 3 will be described focusing on matters different from those described in Embodiment 1 above. Figure 5 It is a side cross-sectional view of main parts showing a configuration example of an injection molding die apparatus according to a third embodiment. exist Figure 5 in, for with figure 1 Components shown that are the same as those shown are labeled with figure 1 The same symbols are assigned to the components shown, and repeated explanations are omitted.

[0087] In the injection molding mold device of the third embodiment, as Figure 5 As shown, a cooling circuit 20 different from the cooling circuit 17 described in Embodiment 1 is provided in the movable side mold 11 , and the cooling circuit 20 is arranged at a position facing the opening end surface of the gate part 13 of the fixed side mold 12 . For example, when cooling water flows through the cooling circuit 20, the diameter of the cooling circuit (water passage h...

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PUM

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Abstract

An injection molding method in which a multilayer film including a base layer and a transfer layer stacked on the base layer is disposed in the molding space of an injection mold, the molding space containing the multiplayer film is filled with resin, and then the injection mold is opened to obtain a molded article transferred with the transfer layer peeled from the base layer, wherein after the resin is injected into the molding space, a cooling circuit near the molding space cools the multilayer film before the injection mold is opened.

Description

technical field [0001] The present invention relates to transferring a transfer layer of a multilayer film arranged in the cavity to the surface of the molded product while obtaining the molded product by injecting molten resin into the molding space (cavity) of the injection molding mold An injection molding method on (transfer surface) and an injection molding mold device for performing the injection molding method. Background technique [0002] In recent years, high-quality appearance specifications such as high gloss, embossing, and no welds have been demanded for resin molded parts. In order to achieve high gloss, it is necessary to transfer the mirror-finished mold surface (cavity formation surface) to the surface of the injection molding resin with high quality. Similarly, in order to achieve embossing, it is necessary to transfer the embossed mold surface to the surface of the injection molding resin with high quality. In order to achieve the above-mentioned high-q...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C45/14B29C45/26B29C45/73
CPCB29C45/0003B29C45/14262B29C45/263B29C45/73B29C2045/1427B29C45/14827B29C2045/7343
Inventor 峯英生中西力平石正和
Owner PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD