4results about How to "Improve processing uniformity" patented technology

This invention relates to a substrate processing apparatus capable of performing deposition, etching, heat treatment, and other substrate processing on multiple substrates. The invention discloses a substrate processing apparatus comprising: a reaction tube (100) forming a processing space (S1) that accommodates multiple substrates (1) and performs substrate processing; a nozzle setting portion (200) protruding outward from a portion of the side of the reaction tube (100) to form an outer portion of the reaction tube (100); and a plurality of gas nozzles (300) arranged vertically around the substrates (1) in the nozzle setting portion (200) to inject process gases into the reaction tube (100); wherein the nozzle setting portion (200) has a plurality of insertion portions corresponding to the gas nozzles (300) for inserting and setting the gas nozzles (300) respectively.

This invention provides a support device and a semiconductor processing apparatus. The support device includes a fixed component and a rotatable rotating component disposed above the fixed component. The fixed component includes a first connecting surface, and the rotating component includes a supporting surface for supporting a wafer and a second connecting surface facing away from the supporting surface. The first connecting surface and the second connecting surface are fitted together. The fixed component includes a fixed body and a cooling channel disposed in the fixed body for supplying cooling liquid. The cooling channel cools the rotating component through heat exchange between the fixed body and the rotating component. With the support device provided by this invention, the wafer can rotate during processing while simplifying the sealing structure, improving the sealing effect, and effectively preventing cooling liquid leakage.

The application discloses a kind of hydraulic loading double screw conveyor muscle and tendon separation efficient fresh meat mincer, belongs to the technical field of meat grinder, fresh meat mincer includes box, the top inlet of box is equipped with fairing, the passage module of uniform control fresh meat delivery is installed in the lower end of fairing, and the upper feeding screw conveyor and the discharge screw conveyor are rotatably installed in passage module, the transmission direction of upper feeding screw conveyor and discharge screw conveyor is perpendicular to each other, and upper feeding screw conveyor is located above discharge screw conveyor;Passage module end is installed with discharge port, discharge port protrudes fixedly in the surface of box, and discharge port is provided with the screening mechanism of auxiliary fresh meat muscle and tendon separation;Fairing includes oblique flow guide channel and straight flow guide channel, reciprocating hydraulic loading mechanism is arranged in oblique flow guide channel and straight flow guide channel;Mincer integrates hydraulic forced dredging, double screw conveyor graded uniform material conveying, muscle and tendon screening and other multiple functions, improve fresh meat processing continuity and finished product meat quality.

The invention discloses a semiconductor laser processing method and device, comprising step S1, pre-treating the surface of a diamond blank, coating a layer of optical enhancement material, and acquiring surface morphology data; step S2, identifying a surface undulation area according to the morphology data; step S3, performing surface regulation processing on the surface undulation area by using preset laser parameters; step S4, cutting and processing by using a laser beam to form a diamond substrate; step S5, performing appearance inspection after cutting, and classifying according to the inspection result; by coating the optical absorption enhancement material on the surface of the diamond blank, the absorption efficiency of the material to the laser is significantly improved, and by using three-dimensional laser scanning and surface regulation processing, the microscopic undulations on the surface of the diamond blank are fully considered, the laser processing uniformity is improved, the cutting accuracy and surface quality of the processing process are improved, and high-quality laser processing of the polycrystalline diamond substrate is realized.