1results about How to "Improve processing uniformity" patented technology

This invention relates to a substrate processing apparatus capable of performing deposition, etching, heat treatment, and other substrate processing on multiple substrates. The invention discloses a substrate processing apparatus comprising: a reaction tube (100) forming a processing space (S1) that accommodates multiple substrates (1) and performs substrate processing; a nozzle setting portion (200) protruding outward from a portion of the side of the reaction tube (100) to form an outer portion of the reaction tube (100); and a plurality of gas nozzles (300) arranged vertically around the substrates (1) in the nozzle setting portion (200) to inject process gases into the reaction tube (100); wherein the nozzle setting portion (200) has a plurality of insertion portions corresponding to the gas nozzles (300) for inserting and setting the gas nozzles (300) respectively.