45results about How to "Improve processing uniformity" patented technology

The invention relates to a snakelike runner movable formwork cluster hole electrochemical machining device and a machining method and belongs to the technical field of electrochemical machining. The snakelike runner movable formwork cluster hole electrochemical machine device and machining method are characterized in that a traditional wide runner is changed into a snakelike runner, the runner is narrowed, and flow field distribution evenness on the cross section of the runner in a machining area is improved; the flow velocity of the machining area is relatively improved, machined products can be fast discharged, electric field and flow field parameters are reasonably selected, the flow field state of the machining area can be stable, and machining quality is improved. The machining device comprises a power supply, an electrolyte circulation system, an electrochemical machining machine tool, a mask plate negative electrode and a tool clamp. The snakelike runner movable formwork cluster hole electrochemical machining device and the machining method have important significance in improving the cluster hole electrochemical machining flow field distribution evenness and ensuring that a large-area thin-wall hole plate can be machined at a time.

The invention relates to an electrostatic chuck used for the semiconductor process, and in particular discloses an electrostatic chuck used for fixing parts to be processed in the processing of semiconductor by virtue of electrostatic attraction. The electrostatic chuck comprises an insulated layer, a heater, a base and a thermal insulating layer arranged between the heater and the base. And the parts to be processed are placed on the insulated layer, the base is used for supporting the insulated layer and the heater, and the thermal insulating layer is used for obstructing the conduction of heat generated by the heater to the base. By virtue of the thermal insulating layer, most of heat generated by the heater is only conducted to the insulated layer, thus leading to sufficiently big rate of temperature increase of such parts to be processed as the electrostatic chuck and the wafers on the chuck and causing the parts to be processed of the wafers and the like so as to reach the predetermined temperature in an extremely short time in the processing of semiconductor (especially in a semiconductor etching process), and finally the processing uniformity (for example, etching) of such parts to be processed as wafers is further enhanced.

The invention provides a special clamp for the abrasive material flow finishing machining of a variable-cross-section specially-shaped channel structure. The special clamp comprises a bottom base plate (9) and a base (5) and is characterized in that the base (5) is arranged in a clamp upper cover (1) in a sleeving manner, the clamp upper cover (1) is fixed to the bottom base plate (9), a workpiece (2) is mounted on the base (5), a fixing ring (4) is mounted on the base (5), and a sharp edge protecting rod (3) is mounted on the fixing ring (4); and an inserting hole is processed in the cylindrical side edge of the clamp upper cover (1), and the main body part of a flow guiding column (7) is inserted into a runner (10) of the workpiece (2). Through the one-time flowing of an abrasive material, the finishing machining of a part comprising the variable-cross-section specially-shaped channel structure is realized. The device is simple, is easy to mount and disassemble, and can realize the high-efficiency and high-precision machining of the part comprising the variable-cross-section specially-shaped channel structure.

The invention belongs to the technical field of surface finishing processing of mechanical parts, in particular to a magnetic grinding tool finishing processing device and method with an adjustable magnetic field and a self-adaptive aperture. The magnetic grinding tool finishing processing device comprises a magnetic field generating device and a self-adaptive aperture mechanism capable of changing the diameter, the self-adaptive aperture mechanism is arranged on the peripheral side of the magnetic field generating device, and the self-adaptive aperture mechanism and the magnetic field generating device are arranged on the inner side of the workpiece to be machined. The magnetic grinding tool finishing processing device can be subjected to finishing processing on the inner hole surface ofthe magnetic material and the non-magnetic material, the whole processing device is simple in structure, simple in process, good in economic benefit and easy to widely apply.

The invention relates to a substrate installation platform, a plasma processing device, and an operation method for the plasma processing device. The device comprises a reaction cavity, and the lower part of the interior of the reaction cavity comprises a conductive substrate, a static chuck, a pallet, and a substrate. The static chuck is fixed on the conductive substrate, and the pallet is placed on the static chuck. The substrate is fixed in the pallet, and the pallet comprises a panel part and an upwards bulged part, wherein the diameter of the upper surface of the panel part is greater than the diameter of the substrate. The bulged part surrounds the panel part and the substrate on the panel part. The diameter of the static chuck is greater than the diameter of the substrate, and is less than or equal to the diameter of the pallet.

The invention provides an ultrasonic-assisted cavitation abrasive grain flow finishing method for titanium alloy surface oxide layers. The method comprises the following steps: stirring a solid-liquidtwo-phase mixed fluid to form high-speed turbulence vortex; extracting the solid-liquid two-phase mixed fluid, mixing the solid-liquid two-phase mixed fluid with micro-nano bubbles to form a high-speed and high-pressure gas-liquid-solid three-phase abrasive grain flow; spraying the high-speed and high-pressure gas-liquid-solid three-phase abrasive grain flow to a workpiece in a tank body for staged surface treatment; meanwhile, emitting ultrasonic waves by an ultrasonic device configured below the workpiece to form an ultrasonic cavitation effect, and forming a negative fluctuation environment with positive and negative pressure alternating rapidly in the high-speed fluid in the tank body to cause expansion and compression of micro-nano bubbles in the high-speed fluid. Under the comprehensive action of turbulence, jet, cavitaiton and ultrasonic waves, a manner of combining cavitation abrasive grain jet and turbulence integrated surrounding type processing and ultrasonic enhancement isadopted, synchronous stripping of different in-situ defects of oxide scale and derivative and chain stripping of new defect points can be realized, the removal efficiency is high, and the processinguniformity is good.

The invention provides a plate surface machining and liquid guide device which comprises a conveying system, an equipment tank, upper nozzles, lower nozzles, a liquid guide pipe, a circulating pump and a spray pump; the upper nozzles are formed above the conveying system; the lower nozzles are formed below the conveying system; the liquid guide pipe is arranged above a circuit board movement way of the conveying system; the equipment tank is arranged below the conveying system; a first mouth of the equipment tank is connected with the upper nozzles and the lower nozzles through the spray pump; an outlet of the liquid guide pipe is connected with a second mouth of the equipment tank through the circulating pump; and a plurality of suction holes are formed in the liquid guide pipe. The pool effect of an upper plate surface can be eliminated, and the machining uniformity of the upper plate surface is better; the equipment tank can be very small, the equipment capacity is 60% of the original equipment capacity, and a temperature, a PH value, the electric conductivity and the ion concentration of liquid in the equipment tank can be adjusted conveniently; in addition, the circulating pump and the spray pump can use independent external pumps, so that the curing and maintenance are convenient, and the discharge amount of waste liquid can be reduced.

The invention provides a surface smoothness treatment method for a clutch pressure plate. The surface smoothness treatment method comprises a treatment bin and a storage assembly, wherein the storageassembly is arranged behind the treatment bin; a first guide rail is arranged on the bottom inside the treatment bin; a U-shaped slide plate is movably mounted on the first guide rail; a supporting plate is arranged on the U-shaped slide plate; a clamping assembly is rotatably mounted on the supporting plate; first electromagnetic slide rails are arranged at the two sides of the top of the treatment bin; and slide bins are movably mounted on the first electromagnetic slide rails. According to the surface smoothness treatment method provided by the invention, the clamping assembly is used for clamping and fixing the clutch pressure plate, a first pneumatic cylinder is utilized to put down a U-shaped frame, and a polishing motor drives a polishing disc to rotate for performing smoothness treatment on the surface of the clutch pressure plate clamped on the clamping assembly; a rotary bin rotates to change the angle of the polishing disc to perform multi-angle polishing, so that stubborn rough spots on the surface of the clutch pressure plate are conveniently removed; and the rotation function of the clamping assembly is utilized to drive the clutch pressure plate to rotate to be matched with polishing, so that processing uniformity further can be improved.

The invention provides an electrochemical method and an electrochemical device. The electrochemical method and the electrochemical device are applied to electrochemical processing such as electroplating and electro-polishing on the surface of a processed object; in particular when the method and the device are applied to a large-dimension processed object, no large current is needed and continuous batch completion can be realized, and the method and the device have the advantages and effects of effectively saving labor, space and time, and being excellent in processing uniformity; the electrochemical method is mainly characterized in that an electrode plate and an electrolyte are arranged in a plating tank module, the processed object is contacted with the electrolyte by virtue of relative movement generated between the plating tank module and the processed object so that an electrolytic reaction is aroused, and then electrochemical processing on the surface of the processed object is realized.

The invention discloses a method for optimizing processing uniformity of a Bi2212 wire rod by gradient assembly, which is characterized in that in a secondary assembly process of a conventional processing technology of the Bi2212 wire rod, a gradient assembly method is adopted, and Bi2212 secondary wires are arranged circle by circle from an inner circle to an outer circle according to a silver super-ratio gradient reduction rule. By designing a gradient assembly process of Bi2212 secondary lines with different silver super ratios, a special gradient structure with a high silver super ratio Bi2212 secondary line on the inner ring and a low silver super ratio Bi2212 secondary line on the outer ring is formed, the plastic deformation of the Bi2212 secondary lines from the inner ring to the outer ring and the matching property of the plastic deformation of the Bi2212 secondary lines from the inner ring to the outer ring and the axial stress of the Bi2212 secondary lines from the inner ring to the outer ring are adjusted, the cooperative deformation of the Bi2212 secondary lines from the inner ring to the outer ring is improved, and the mechanical property of the Bi2212 secondary lines from the inner ring to the outer ring is improved. The processing uniformity of the Bi2212 wire rod is optimized from the intrinsic aspect, and the method has good application advantages and engineering prospects in the processing process of the Bi2212 wire rod.