Method for characterizing processing uniformity of Bi-series high-temperature superconducting wire or strip

A high-temperature superconducting and uniformity technology, which is applied in the usage of superconducting elements, superconducting devices, superconducting/high-conducting conductors, etc., can solve the limited testing method for processing uniformity of Bi-based high-temperature superconducting wires or strips To improve the overall current-carrying performance, sampling spoon, and improve the uniformity of processing

Active Publication Date: 2020-10-13
NORTHWEST INSTITUTE FOR NON-FERROUS METAL RESEARCH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Currently, there are very limited testing methods for processing uniformity of Bi-based high-temperature superconducting wires or strips reported publicly.

Method used

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  • Method for characterizing processing uniformity of Bi-series high-temperature superconducting wire or strip
  • Method for characterizing processing uniformity of Bi-series high-temperature superconducting wire or strip
  • Method for characterizing processing uniformity of Bi-series high-temperature superconducting wire or strip

Examples

Experimental program
Comparison scheme
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Embodiment 1

[0046] This embodiment includes the following steps:

[0047] Step 1: Cut a sample with a length of 100 cm from the head end of the primary wire (10 m in length) during the processing of the Bi2212 high-temperature superconducting wire as the profile 5, and then the first wire 1, the second wire 2, the third wire 3 and The fourth wire 4 is wound and fixed on the profile 5 in turn, and the fixed position of the first wire 1, the second wire 2, the third wire 3 and the fourth wire 4 on the profile 5 is defined as the first position (the head end of the profile 5 within the range of 0 to 20 cm), and determine the distance L between the fixed point of the second wire 2 on the profile 5 and the fixed point of the third wire 3 on the profile 5 to be 10.0 cm; the first wire 1, the second wire The material of the second wire 2, the third wire 3 and the fourth wire 4 is copper;

[0048] Step 2, load the current I through the first wire 1 and the fourth wire 4 and form a loop with the ...

Embodiment 2

[0052] This embodiment includes the following steps:

[0053] Step 1. Cut a sample with a length of 60 cm from the head end of the secondary wire (6m in length) during the processing of the Bi2212 high temperature superconducting wire as the profile 5, and then place the first wire 1, the second wire 2, and the third wire 3 and the fourth wire 4 are wound and fixed on the profile 5 in turn, and the fixed position of the first wire 1, the second wire 2, the third wire 3 and the fourth wire 4 on the profile 5 is defined as the first position (the head of the profile 5 end within the range of 0-20cm), and determine that the distance L between the fixed point of the second wire 2 on the profile 5 and the fixed point of the third wire 3 on the profile 5 is 10.0cm; the first wire 1, The materials of the second wire 2, the third wire 3 and the fourth wire 4 are all copper;

[0054] Step 2, add a voltage dividing resistor with a resistance value r=0.001Ω in the first copper wire 1, t...

Embodiment 3

[0059] This embodiment includes the following steps:

[0060] Step 1, in the processing process of the Bi2212 high temperature superconducting wire rod, the head end and the tail end of the third wire rod (14m in length) are respectively intercepted as samples with a length of 20cm as the profile 5, and then the first wire 1, the second wire 2, the second wire The three wires 3 and the fourth wire 4 are wound and fixed on the profile 5 in turn, and the fixed positions of the first wire 1, the second wire 2, the third wire 3 and the fourth wire 4 on the profile 5 are determined as the first position (three times) The length of the head end of the wire is 20cm), and the distance L between the fixed point of the second wire 2 on the profile 5 and the fixed point of the third wire 3 on the profile 5 is 10.0cm; the first wire 1 , the materials of the second wire 2, the third wire 3 and the fourth wire 4 are all copper;

[0061] Step 2, load the current I through the first wire 1 a...

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Abstract

The invention discloses a method for characterizing the processing uniformity of a Bi-series high-temperature superconducting wire or strip. According to the method, the resistance at different positions of the Bi-system high-temperature superconducting wire or strip is tested based on the principle of testing the room-temperature resistance through a four-wire method, and then the processing uniformity of the Bi-series high-temperature superconducting wire or strip is represented through the resistance difference at the different positions. According to the method of the invention, the methodfor testing the room temperature resistance based on the four-wire method is adopted; a primary wire, a secondary wire, a composite wire or strip, or a Bi-system high-temperature superconducting composite wire or strip sample in the processing process of the Bi-series high-temperature superconducting wire or strip is detected; the processing uniformity of different processing stages is characterized through the resistance difference at the different positions, real-time monitoring of the processing uniformity in the preparation process of the Bi-series high-temperature superconducting wire orstrip is achieved, and a guidance direction is provided for optimizing processing parameters in the preparation process of the Bi-series high-temperature superconducting wire or strip and improving the processing uniformity of the wire.

Description

technical field [0001] The invention belongs to the field of performance testing and characterization of high-temperature superconducting wire strips, and in particular relates to a method for characterizing the processing uniformity of Bi-based high-temperature superconducting wires or strips. Background technique [0002] The macroscopic current-carrying performance and the uniformity of mechanical properties of Bi-based high-temperature superconducting wire tape are the key to its engineering application. In addition, core wire leakage is a key problem that hinders the application of Bi-based high-temperature superconducting wire strips to magnet technology. Good processing uniformity of wire or strip can effectively reduce the broken core rate, which is very important for improving the uniformity of macroscopic current-carrying properties and mechanical properties of Bi-based high-temperature superconducting wire strips; at the same time, good processing uniformity can e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B12/04H01B13/00
CPCH01B12/04H01B13/00Y02E40/60
Inventor 李珍宝白利峰徐晓燕焦高峰郝清滨李成山张胜楠邵柏淘冯建情吴怡芳
Owner NORTHWEST INSTITUTE FOR NON-FERROUS METAL RESEARCH
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