Electrode assembly

A technology of electrodes and electric fields, applied in the field of substrate devices, can solve the problems of high manufacturing costs

Inactive Publication Date: 2003-08-20
LAM RES CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, the edge of the substrate is usually not used to make the IC, the result is higher manufacturing cost

Method used

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  • Electrode assembly
  • Electrode assembly
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Embodiment Construction

[0015] Detailed description of the preferred embodiment

[0016] During substrate processing, one of the most important parameters that process engineers strive to improve is process uniformity. As the term is used herein, process uniformity refers to the uniformity of the overall process across the surface of the substrate. For example, if processing is to be highly uniform, it is desirable that the processing rates at different points on the substrate tend to be substantially equal. In this case, it is less likely that one region of the substrate will be unduly overprocessed while other regions remain underprocessed.

[0017] The present invention therefore relates to improved methods and apparatus for processing substrates. More specifically, the present invention relates to a substrate holder capable of producing a high degree of process uniformity across the surface of the substrate. The substrate support is configured to reduce electrical and thermal discontinuities t...

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Abstract

A plasma processing system for processing a substrate is disclosed. The plasma processing system includes a process chamber within which a plasma is both ignited and sustained for processing. The plasma processing system further includes an electrode (152) disposed at the lower end of the process chamber. The electrode is configured for generating an electric field inside the process chamber. The plasma processing system also includes a component (158) for controlling an impedance between the electrode and the plasma. The impedance is arranged to affect the electric field to improve processing uniformity across the surface of the substrate.

Description

Background of the invention [0001] The present invention relates to apparatus and methods for processing substrates such as semiconductor substrates used in IC manufacturing or flat panels (eg, glass, plastic, etc.) used in flat panel display applications. More precisely, the present invention relates to methods and devices capable of processing substrates with a high degree of processing uniformity across the substrate surface. [0002] Over the years, plasma processing systems utilizing inductively coupled plasma sources, electron cyclotron resonance (ECR) sources, capacitive sources, etc., have been introduced and applied to various degrees to process semiconductor substrates and display panels. During the manufacture of these products, multiple deposition and / or etch steps may be employed. During deposition, material is deposited onto a substrate surface (eg, a glass plate or the surface of a wafer). For example, deposited layers, such as various forms of silicon, silico...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05H1/46C23C16/505H01J37/32H01L21/205H01L21/3065
CPCH01J37/32623H01J37/32642H01L21/00
Inventor F·郝A·R·埃林贝E·H·伦茨
Owner LAM RES CORP
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