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Electro-Fenton cluster magneto-rheological composite grinding and polishing device and method

A polishing device and magnetorheological technology, which are applied in the direction of grinding/polishing safety devices, grinding/polishing equipment, surface polishing machine tools, etc., can solve the problem of low polishing efficiency, low processing efficiency and workpiece processing of magnetorheological polishing technology. Uniformity is difficult to guarantee and other problems, to achieve the effect of improving processing efficiency and processing uniformity, reducing cost, improving processing efficiency and processing quality

Pending Publication Date: 2020-03-24
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Magneto-rheological polishing technology has the advantages of good polishing effect, no sub-surface damage, and suitable for complex surface processing. It has become a revolutionary optical surface processing method, especially suitable for ultra-precision processing of axisymmetric aspheric surfaces. , widely used in the final processing of large optical components, semiconductor wafers, LED substrates, liquid crystal display panels, etc., but the polishing efficiency of magnetorheological polishing technology is low
[0003] In order to improve the polishing efficiency of magnetorheology, Chinese patent CN200610132495.9 proposes a grinding and polishing method and its polishing device based on the magnetorheological effect based on the principle of magnetorheological polishing and the mechanism of cluster action. Surface area polishing pad, but the processing uniformity of the workpiece is difficult to guarantee; Chinese patent CN201510801886.4 proposes a dynamic magnetic field self-sharpening magnetorheological flexible polishing pad generator and its polishing method, which realizes the magnetorheological flexible polishing pad in the During the processing, the workpiece is processed under constant pressure, and the abrasive can be updated and self-sharpened in real time during the processing, but the processing efficiency is low

Method used

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  • Electro-Fenton cluster magneto-rheological composite grinding and polishing device and method
  • Electro-Fenton cluster magneto-rheological composite grinding and polishing device and method
  • Electro-Fenton cluster magneto-rheological composite grinding and polishing device and method

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Embodiment 1

[0046] Such as Figure 1 to Figure 8 Shown is an embodiment of the electric Fenton cluster magnetorheological compound grinding and polishing device of the present invention, including a base 1, a cluster magnet 2, an autorotation transmission assembly 3 that drives the cluster magnet 2 to rotate, and a revolution transmission assembly 4 that drives the cluster magnet 2 to revolve , the first driving assembly 5 that provides power for the rotation and revolution of the cluster magnet 2, the polishing disk 6 filled with magnetorheological fluid, the second driving assembly 7 that drives the polishing disk 6 to rotate, and the electric Fenton reaction that can produce OH The electric Fenton assembly 8 of the reactant, the cluster magnet 2 is installed on the rotation transmission assembly 3, the rotation transmission assembly 3 is connected between the cluster magnet 2 and the first drive assembly 5, and the revolution transmission assembly 4 is connected to the first drive assem...

Embodiment 2

[0067] This embodiment is an embodiment of a grinding and polishing method for processing a 2-inch single-crystal SiC substrate by an electric Fenton cluster magnetorheological composite grinding and polishing device. In this embodiment, diamond abrasives of 100nm to 500nm and 5 μm to 10μm carbonyl iron powder is used as a composite abrasive, and the working method includes the following steps:

[0068] S1. Install the grinding and polishing device on the XY precision mobile platform and move to the origin;

[0069] S2. Install the single crystal SiC workpiece to be processed on the head of the polishing shaft, adjust the gap between the polishing disc 6 and the workpiece to be processed by adjusting the height of the polishing shaft, so as to ensure the grinding and polishing pressure and make the dynamic flexible polishing pad stably formed;

[0070] S3. Configure the magnetorheological fluid and adjust the pH value, and inject it into the polishing disc 6;

[0071] S4. Sta...

Embodiment 3

[0082] This embodiment is an embodiment of a grinding and polishing method for processing a 2-inch single crystal silicon wafer by an electric Fenton cluster magnetorheological compound grinding and polishing device. The carbonyl iron powder of 5 μm is used as composite abrasive material, and this embodiment is similar to the working method of embodiment two, and the difference is:

[0083] In step S3, the magnetorheological fluid is prepared according to the following component ratios and steps: add a composite abrasive with a concentration of 15%, a dispersant with a concentration of 10%, and an antirust agent with a concentration of 5% in deionized water, and stir thoroughly After uniformity, adjust the pH to 3, and then ultrasonically oscillate for 20 minutes to make a composite magnetorheological fluid;

[0084] In step S4, the rotational speed of the first motor 51 is adjusted to 400 rpm, and the rotational speed of the second motor 71 is 100 rpm;

[0085] In step S5, t...

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Abstract

The invention relates to the technical field of ultra-precision machining and particularly relates to an electro-Fenton cluster magneto-rheological composite grinding and polishing device and method.The device comprises a base, a cluster magnet, an autorotation transmission assembly, a revolution transmission assembly, a first driving assembly, a polishing disc containing magnetorheological fluid, a second driving assembly and an electro-Fenton assembly, wherein the cluster magnet is installed on the autorotation transmission assembly, the autorotation transmission assembly is connected between the cluster magnet and the first driving assembly, the revolution transmission assembly is connected between the first driving assembly and the autorotation transmission assembly, the polishing disc is connected with the second driving assembly, and the polishing disc is located above the cluster magnet. The device is advantaged in that an electro-Fenton reaction product OH reacts with a machined workpiece to generate an oxide layer, the cluster magnet rotates and revolves, the polishing disc rotates, the magnetorheological fluid forms a dynamic flexible polishing pad under the action of the cluster magnet, the oxide layer is removed under the action of the dynamic flexible polishing pad, and workpiece machining efficiency and the machining quality can be improved.

Description

technical field [0001] The invention relates to the technical field of ultra-precision machining, and more specifically, to an electro-Fenton cluster magnetorheological compound grinding and polishing device and method. Background technique [0002] Due to its high strength, high hardness, high brittleness, wear resistance and corrosion resistance, heat insulation, low density and low expansion coefficient and stable chemical properties, hard and brittle materials are widely used in electronics, optics, instrumentation, aerospace, civil and military industries, etc. The application potential in this field is huge. With the development of modern high technology, the demand for planar hard and brittle materials is becoming more and more extensive, but the surface quality of hard and brittle materials has become a key factor restricting its application. Brittle materials have the disadvantages of low plasticity, brittle failure, microcracks and improper processing technology, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B1/00B24B31/10B24B31/12B24B27/033B24B41/02B24B55/00
CPCB24B1/005B24B31/102B24B31/12B24B27/033B24B41/02B24B55/00
Inventor 潘继生张棋翔邓家云阎秋生
Owner GUANGDONG UNIV OF TECH
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