Electrochemical method and electrochemical device

An electrochemical and positive technology, applied in the electrolysis process, electrolysis components, etc., can solve the problems of the limitation of the plating tank, the unsatisfactory uniformity of the electroplated metal layer, and the increase of the process cost.

Inactive Publication Date: 2014-06-11
BOARDTEK ELECTRONICS CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the workpiece size applicable to the immersion plating method will be limited by the size of the plating tank, especially for bulky workpieces or workpieces that only need to be electroplated in a local area, it is difficult to meet the requirements
And especially when the size of the workpi

Method used

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  • Electrochemical method and electrochemical device
  • Electrochemical method and electrochemical device
  • Electrochemical method and electrochemical device

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Embodiment Construction

[0042] Such as figure 1 It is a perspective view of the structure of the electrochemical device of the present invention, figure 2 It is an exploded view of the structure of the electrochemical device of the present invention, and image 3 As shown in the structural diagram of the electrochemical device of the present invention, the electrochemical device 1 of the present invention at least includes: an electroplating tank module 10, an electrode plate 20, an electrolyte 30, a power supply module 40, a mobile module 50 and a control module Group 60.

[0043] Wherein: the electroplating tank module 10 is provided with two opposite cylinders 11 and two stoppers 12 respectively located between the two cylinders 11, and a working space 13 is surrounded by each cylinder 11 and the stoppers 12; and the electrode plate 20 and the electrolyte 30 is located in the working space 13. In the embodiment shown in the figure, the electroplating tank module 10 is further provided with a fi...

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Abstract

The invention provides an electrochemical method and an electrochemical device. The electrochemical method and the electrochemical device are applied to electrochemical processing such as electroplating and electro-polishing on the surface of a processed object; in particular when the method and the device are applied to a large-dimension processed object, no large current is needed and continuous batch completion can be realized, and the method and the device have the advantages and effects of effectively saving labor, space and time, and being excellent in processing uniformity; the electrochemical method is mainly characterized in that an electrode plate and an electrolyte are arranged in a plating tank module, the processed object is contacted with the electrolyte by virtue of relative movement generated between the plating tank module and the processed object so that an electrolytic reaction is aroused, and then electrochemical processing on the surface of the processed object is realized.

Description

technical field [0001] The present invention relates to an electrochemical method and its device, especially an electrochemical method and its device which can save power, effectively save manpower, space and time, and have good processing uniformity. Background technique [0002] Electrochemical technology is one of the most important processing technologies in the industry in recent years. Because electrochemical technology involves chemical reactions in which electrons are transferred, it has a wide range of applications. The main application of electrochemical technology is the electroplating process. [0003] The electroplating process has been widely used to repair the worn workpiece surface. For example, hard chrome plating is used for the surface treatment of hydraulic cylinders and rollers, while electroplating copper or nickel metal is often used to fill the worn area of ​​the workpiece. , In addition, silver plating is also often applied to the workpiece of circ...

Claims

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Application Information

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IPC IPC(8): C25D5/02C25D5/04C25D17/00C25F7/00
Inventor 郑文锋许吉昌游辉鑫陈昆民林建利林建中
Owner BOARDTEK ELECTRONICS CORP
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