LED injection molding module

Abstract

The invention discloses an LED injection molding module, and relates to the field of novel LED lighting. The LED injection molding module mainly comprises a PCB provided with a plurality of LED lamp beads, a U-type wire clamp, an electronic wire and an injection molding outer shell. A wire clamping groove in one end of the U-type wire clamp is electrically communicated with the electronic wire, a rectangular copper piece at the other end of the U-type wire clamp is in compression contact with a rectangular welding disc on the PCB through pressure generated by the elastic modulus deformation, the electric communication between the electronic wire and the PCB is achieved through the U-type wire clamp, the injection molding outer shell tightly wraps the whole PCB through a sealing waterproof mode, and through holes which allow the electronic wire to penetrate are formed in the two ends of the outer shell. The LED injection molding module is simple in structure, convenient to assemble, simple in production process, low in production cost, high in production efficiency and suitable for large-scale batch production.

Description

technical field [0001] The invention relates to a novel LED lighting field, in particular to an LED injection molding module and its PCB board, line card, and injection molding shell. Background technique [0002] Due to its low power consumption, long life, simple structure, and convenient installation, LED modules are widely used in advertising light boxes, indicator lights, decorative lighting and other places. With the gradual maturity of LED module technology, its application range is wider . [0003] At present, most of the LED modules on the market use the traditional welding technology to weld the electronic wires on the PCB board at high temperature to realize the electrical conduction between the electronic wires and the PCB board. This method has low production efficiency and is easy to cause In the process of cascading multiple modules, the positive and negative poles are reversed, false soldering, false soldering, hot pads and other bad phenomena make the LED m...

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Problems solved by technology

[0003] At present, most of the LED modules on the market use the traditional welding technology to weld the electronic wires on the PCB board at high temperature to realize the electrical conduction between the electronic wires and the PCB board. This method has low production efficiency and is easy to cause In the process of cascading multiple modules, the positive and negative poles are reversed, false soldering, false soldering, hot pads and other bad phenomena make the LED module potentially unstable, and it is prone to partial or overall failure in the actual use process

[0004] At present, most of the waterproofing of LED modules on the market adopts the method of potting and sealing. This method is costly and complicated. Long, there are air bubbles on the surface, glue overflow and glue leakage, etc. Once defective products are produced, it is difficult to repair them. Therefore, the method of glue filling and sealing is obviously not suitable for large-scale application in LED modules

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