Method for analyzing bonding interface of bonder based on micro-Raman micro-zone analysis technology
A technology of Raman micro-area and analysis technology, which is applied in Raman scattering, material excitation analysis, preparation of test samples, etc. It can solve problems such as interface separation and change of HTPB bonding effect, and achieve less sampling and short test time Effect
Active Publication Date: 2014-01-15
WUHAN UNIV
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Problems solved by technology
In addition, as a one-time use of strategic materials, propellants often need to be stored for a long time, and physical and chemical changes will inevitably occur during the storage process, which will lead to changes in the bonding effect of HTPB and even interface separation
Method used
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Embodiment
[0037] In step 1, a small piece is cut from the HTPB propellant sample as a sample, and cryosectioned along the direction perpendicular to the bonding interface to obtain an HTPB sheet sample containing a complete bonding interface layer.
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Abstract
The invention provides a method for analyzing the bonding interface of a bonder based on a micro-Raman micro-zone analysis technology. The method comprises the following steps: freezing a bonder sample for slicing in a direction vertical to the bonding interface to obtain a slice-shaped bonder sample with a complete bonding interface layer; selecting one point from each of the two sides of the bonding interface layer of the slice-shaped bonder sample, and performing single-point Raman spectrum scanning on the selected points to obtain single-point Raman spectrograms; comparing peaking positions and peak intensity in the single-point Raman spectrograms of the two selected points, and using one peak position with changed peak intensity as a scanning peak position of micro-Raman micro-zone analysis; using the scanning peak position obtained in the step 3 as a scanning range, and performing micro-Raman micro-zone analysis and scanning on a selected micro zone of the cross bonding interface of the slice-shaped bonder sample to obtain a micro-Raman micro-zone analysis spectrogram for reflecting the state of bonding interface of the bonder. The method can be used for conveniently, accurately, quickly and intuitively observing the state of bonding interface of the bonder and is especially suitable for analyzing and observing the state of bonding interface of HTPB.
Description
[0001] technical field [0002] The invention relates to the application field of micro-Raman micro-area analysis technology, in particular to a method for analyzing adhesive bonding interface based on micro-Raman micro-area analysis (mapping) technology. Background technique [0003] Hydroxyl-terminated polybutadiene (HTPB) generally refers to the homopolymer or copolymer of butadiene with an average of two or more hydroxyl groups at both ends of each macromolecule. It can be made by chain extension and cross-linking curing reaction. Elastomers with a three-dimensional network structure. Since HTPB has the advantages of low glass transition temperature, low price, low viscosity, good electrical properties and process performance, it is widely used as a high-performance adhesive, especially in the field of special solid propellant bonding, which has important application significance. [0004] HTPB propellant is the main type of propellant used at present and for a long per...
Claims
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Login to View More IPC IPC(8): G01N21/65G01N1/28
Inventor 庞爱民方鹏飞刘杨杜锡娟池旭辉
Owner WUHAN UNIV