Camera unit and device, integrated display and camera device, and camera method

Abstract

The invention discloses an imaging unit and device, an integrated display and imaging device and an imaging method, which can reduce the influence of dispersion and aberration phenomena on imaging and improve image quality. The camera unit of the present invention is used to collect image information, and the imaged pixel block includes one or several pixels, including: a tubular directional shading plate, a lens group and a photosensitive module arranged in sequence along the light incident direction with the optical axis; The tubular directional shading plate eliminates non-parallel light signals entering the tubular directional shading plate, allowing parallel light signals parallel to the axis of the tubular directional shading plate to pass through, and the lens group converges the parallel light signals passing through the tubular directional shading plate On the photosensitive module, it is converted into an electrical signal by the photosensitive module. The camera device includes the camera unit, and the camera units are arranged in an array to form an N×M camera array. Each camera unit shoots a scene in the scene to be photographed, and each scene is independently imaged, and is combined to form a complete image.

Description

technical field [0001] The present invention relates to the display field, in particular to a camera unit, a camera device, a display camera integrated device, a camera method and a video image processing method. Background technique [0002] Mobile phone cameras generally include different components such as plasticized or vitrified lenses, pupil devices, baffle devices, drivers, lens holders, cylinders, filters, image sensors, etc., which are independently manufactured and assembled. In order to meet market requirements and reduce manufacturing and packaging costs, mobile phone manufacturers are considering using wafer-level camera manufacturing technology. In this wafer-level camera manufacturing technology, all components are manufactured and packaged at the wafer level using standard semiconductor technology, mainly including the manufacture of optical wafers and complementary metal oxide semiconductor (Complementary Metal Oxide Semiconductor, hereinafter referred to as...

AI Technical Summary

Problems solved by technology

However, this does not obey the laws of optics at the microscopic level, and shrinking the pixel size in an image sensor cannot be achieved without compromising performance or image quality because: shrinking the photosensitive element reduces the light-harvesting ability, resulting in smaller The pixels collect less photons, which will inevitably cause more photon noise and reduce the imaging quality; and shrink the optical device, correspondingly, the lens diameter is smaller and the focal length is shorter, and for the same light collection ability, it is affected by diffraction The limited spot size does not depend on the diameter of the lens, so when the lens size is small, the number of resolvable image points will be greatly reduced, which will also lead to a decrease in imaging quality; and the reduction of the photosensitive element will reduce the light collection ability. In order to ensure the imaging quality, it is necessary to increase the lens diameter, increase the depth of the lens depression and reduce the depth of focus, and more lenses will be required to correct optical distortion, resulting in a decrease in the yield of the camera

[0004] To sum up, the existing camera devices generally use small pixel size, and the area of ​​a single photosensitive element is minimized, which will inevitably bring about the above-mentioned problems inside, which will affect the image quality and cost.

In addition, the existing camera devices generally use the overall imaging on a single photosensitive surface, and the phenomenon of dispersion and aberration is difficult to eliminate, which also affects the image quality.

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