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lighting device

A technology for lighting devices and heat sinks, which is applied to lighting devices, lighting device parts, and cooling/heating devices for lighting devices, etc. Problems such as poor performance, to achieve the effect of green luminous efficiency, high luminous efficiency and long life

Inactive Publication Date: 2018-11-09
OSRAM GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the circuit board itself has a certain thickness, which invisibly increases the thermal resistance between the LED chip and the heat sink, and its heat dissipation performance is not good, especially when the FR-4 type circuit board is used. Low

Method used

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Embodiment Construction

[0026] figure 1 A cross-sectional view of the lighting device 100 according to the present invention is shown, and it can be seen from the figure that the lighting device 100 according to the present invention includes: a circuit board 1; a first light source 21 arranged on the first side of the circuit board 1 and a A first heat sink 31 of a light source 21 ; and a second light source 22 arranged on a second side of the circuit board 1 opposite to the first side and a second heat sink 32 assigned to the second light source 22 . It can be seen from the figure that the first heat dissipation device 31 is arranged around the first light source 21 , and the second heat dissipation device 32 is arranged around the second light source 22 . exist figure 1 In the embodiment shown in , a first through hole 311 and a second through hole 321 are respectively formed in the center of the first heat sink 31 and the second heat sink 32, and the first light source 21 is installed in the fir...

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Abstract

The invention relates to a lighting device (100) which comprises a circuit board (1). The lighting device (100) further comprises a first light source (21), a first heat dissipation device (31), a second light source (22) and a second heat dissipation device (32), wherein the first light source (21) is arranged on the first side of the circuit board (1), the first heat dissipation device (31) is matched with the first light source (21), the second light source (22) is arranged on the second side opposite to the first side of the circuit board (1), and the second heat dissipation device (32) is matched with the second light source (22).

Description

technical field [0001] The invention relates to a lighting device. Background technique [0002] LED lighting has the advantages of high luminous efficiency, low energy consumption and environmental protection. At the same time, with the continuous development of LED lighting technology, its cost is getting lower and lower. Therefore, people are more and more willing to use it as a light source in existing types of lighting devices, especially in LED sign lighting devices. [0003] LED signage lighting devices are usually designed to arrange LED chips on both sides of the circuit board at the same time. In this type of signage lighting, FR-4 type circuit boards are usually chosen, which are inexpensive. But a prominent problem is that the thermal conductivity of the FR-4 type circuit board is poor. However, the LED chips densely arranged on both sides of the circuit board aggravate the heat dissipation problem of the lighting device. The most direct impact of poor heat ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21K9/20F21V29/503F21V17/00F21V23/06F21Y115/10F21K9/69F21V29/74F21V29/85
Inventor 王华冯耀军何源源张新建
Owner OSRAM GMBH