LED material strap with identification structure

Abstract

The invention discloses an LED material strap with an identification structure. The LED material strap comprises a plurality of lead frame sets, main joint sections, a plurality of clamping sheets, first support units and second support units, the lead frame sets are connected in an equal-distance mode and arranged linearly, each lead frame set comprises support units in a certain number, the main joint sections are connected with the support units in series and are in extending connection with the adjacent lead frame sets, the clamping sheets are arranged between the adjacent support units and protrude and extend out of one lateral sides of the main joint sections, the first support units and the second support units are arranged on two outer sides of the lead frame sets respectively, the number of the first support units is not equal to that of the second support units, and the total of the number of the first support units and the number of the second support units is equal to the number of the support units included in each lead frame set. The direction of the LED material strap is judged through the structure.

Description

technical field [0001] The invention relates to an LED material strip, in particular to an LED material strip with an identification structure. Background technique [0002] Please refer to figure 1 As shown, the vertical light-emitting diode support structure is provided with a plurality of equidistantly connected support units 20a on a lead frame 10a, and each support unit 20a is respectively provided with two opposite first pins 21a and second pins. pin 22a, and a bowl-shaped recess 210a is formed on the upper end of the first pin 21a for carrying and fixing a chip (solid crystal, Die bond). In addition, the upper end of the second pin 22a has a contact point for power supply Connect a wire; Then, connect the chip on the first pin 21a and the contact point on the second pin 22a by welding (connecting wire, Wiring), after the electrical connection is completed, pass through the packaging material (such as Epoxy resin) to be packaged and packaged, and operations such as c...

AI Technical Summary

Problems solved by technology

[0003] However, in the manufacturing process of the above-mentioned light-emitting diode, because the chip of the light-emitting diode must be arranged on the first pin 21a, and the second pin 22a is used for connecting and bonding wires, therefore, the lead frame 10a must have a certain The direction is placed in the mold to place the chip on the correct pins, and the subsequent wire bonding and packaging process

[0004] The conventional method for judging the directionality of the lead frame 10a is to cut a bevel 30a on one side of the lead frame 10a, and through the setting of the bevel 30a, it can be judged whether the lead frame 10a is placed correctly; however, the conventional The bevel 30a of the lead frame 10a needs to be provided with another mold for secondary processing. The manufacturing process is time-consuming and has additional mold costs, which in turn leads to an increase in product cost. This is what the inventors want to actively improve.

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