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LED packaging structure

A technology of light-emitting diodes and packaging structures, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of affecting the service life of light-emitting diode packaging structures, affecting the service life of reflective cups, and easy yellowing, so as to achieve long service life, Good high temperature resistance and good stability

Inactive Publication Date: 2014-02-12
ZHANJING TECH SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, plastics with a cyclohexane structure are prone to yellowing due to high temperature
The light-emitting diode chip releases more heat during work, which will affect the service life of the reflective cup, and then affect the service life of the entire light-emitting diode packaging structure.

Method used

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  • LED packaging structure
  • LED packaging structure
  • LED packaging structure

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Experimental program
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Embodiment Construction

[0014] Please refer to figure 1 , is a schematic cross-sectional view of the light emitting diode package structure 100 provided in the first embodiment of the present invention. The LED packaging structure 100 includes a bracket 10 , a LED chip 20 disposed on the bracket 10 , a reflective cup 30 and a packaging body 40 .

[0015] In this embodiment, the bracket 10 includes a substrate 11 , first pins 12 and second pins 13 respectively fixed on opposite ends of the substrate 11 . The substrate 11 is flat and has an upper surface 111 and a lower surface 112 opposite thereto. The first pin 12 and the second pin 13 are both made of metal material and bent into a U-shape, respectively extending from opposite ends of the upper surface 111 of the substrate 11 to the lower surface 112 of the substrate 11 .

[0016] The LED chip 20 is disposed on the first pin 12 and is electrically connected to the second pin 13 through a wire.

[0017] The reflective cup 30 is disposed on the upp...

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PUM

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Abstract

An LED packaging structure comprises a support, an LED chip and a reflection cup. The support is provided with an upper surface, the LED chip is arranged on the upper surface of the support, the reflection cup is arranged on the upper surface of the support and surrounds the LED chip, and the reflection cup is made of plastics of a decahydronaphthalene structure. The plastics of the decahydronaphthalene structure is strong in high-temperature resistance, and not prone to deterioration, so that the reflection cup made of the plastics of the decahydronaphthalene structure also has good high-temperature resistance, and the LED packaging structure is high temperature resistant, good in stability, and long in service life.

Description

technical field [0001] The invention relates to a light emitting diode packaging structure. Background technique [0002] Light Emitting Diode (LED, Light Emitting Diode) has the advantages of high brightness, low operating voltage, low power consumption, easy matching with integrated circuits, simple driving, and long life, so it can be widely used as a light source in the lighting field. [0003] Generally, during the packaging process of the LED chip, a reflective cup is arranged around the LED chip to reflect the light irradiated thereon to the light exit surface, thereby improving the light output efficiency of the LED packaging structure. The material of the existing reflection cup is generally plastic with cyclohexane structure. However, due to the cyclohexane structure, the plastic is easily yellowed by high temperature. However, the light-emitting diode chip releases more heat during operation, which will affect the service life of the reflective cup, and further ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/60
CPCH01L2224/16245H01L2224/48091H01L2224/73257H01L2924/00014H01L33/60
Inventor 谢雨伦
Owner ZHANJING TECH SHENZHEN