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Cleaning fluid flow control system and control method

A technology for flow control and cleaning fluid, applied in control/regulation systems, non-electric variable control, and simultaneous control of multiple variables, etc., can solve the problems of high production cost, occupy a lot of space, and large control valve volume, and achieve structural Simple, cost-reducing effect

Active Publication Date: 2018-09-04
ACM RES SHANGHAI
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Although the system can accurately and stably control the flow of cleaning fluid in each channel, when there are several cleaning fluid delivery channels, a corresponding number of control valves are required. Because the control valves are expensive, the production of the entire system The cost is high. At the same time, the volume of the control valve is relatively large, which takes up a lot of space, which brings inconvenience to the design and installation of the entire system.

Method used

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  • Cleaning fluid flow control system and control method
  • Cleaning fluid flow control system and control method
  • Cleaning fluid flow control system and control method

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no. 1 example

[0031]According to the first embodiment of the cleaning liquid flow control system of the present invention, the working principle of the cleaning liquid flow control system of the present invention is briefly introduced below. The pressure sensor 20 measures the pressure of the cleaning fluid flowing through the control valve 10 in real time, and transmits the measured pressure value to the controller 40 . The controller 40 receives the pressure value and compares the pressure value with a preset target pressure value. If Pc>Pt, the controller 40 sends a smaller current signal to the I / P converter 30, and the I / P converter 30 reduces the pressure of the compressed air delivered to the control valve 10 after receiving the smaller current signal output by the controller 40; if PcFt, the needle valve 50 in the corresponding branch needs to be adjusted down, so as to reduce the flow rate of the cleaning solution in the corresponding branch , at the same time, the pressure of the ...

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Abstract

The invention discloses a cleaning fluid flow control system, which comprises a control valve, a pressure sensor, a controller, an I / P converter, a flow switch and a pin valve, wherein cleaning fluid flows through the control valve; the pressure sensor measures pressure of the cleaning fluid flowing through the control valve and outputs a pressure value; the controller receives the pressure value outputted by the pressure sensor, compares the pressure value with a target pressure value, generates and sends a current signal according to a comparison result; the controller sends a small current signal if the pressure value is greater than the target pressure value, and sends a large current signal if the pressure value is smaller than the target pressure value; the I / P converter receives the current signal outputted by the controller and delivers compressed air with corresponding pressure to the control valve; the I / P converter reduces the pressure of the compressed air delivered to the control valve when receiving the small current signal, and the I / P converter increases the pressure of the compressed air delivered to the control valve when receiving the large current signal; the flow switch measures the flow rate of the cleaning fluid; and the pin valve regulates the flow rate of the cleaning fluid. The invention further discloses a cleaning fluid flow control method.

Description

technical field [0001] The invention relates to a semiconductor device manufacturing process, in particular to a cleaning fluid flow control system and a control method, which can accurately and stably control the cleaning fluid flow. Background technique [0002] In the manufacturing process of semiconductor devices, wafers are easily contaminated, and small pollutants, such as particles attached to the surface of the wafer, organic residues, metal impurities and oxides on the surface of the wafer, will cause great damage to the performance of semiconductor devices , and as the feature size of semiconductor devices becomes smaller and smaller, the harmfulness of pollutants will become more and more harmful, and almost every step of the process may introduce pollution. Therefore, in order to obtain high-quality semiconductor devices, it is very necessary and critical to clean the wafer. With the rapid development of semiconductor technology, there are currently many cleanin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G05D27/02H01L21/67
Inventor 王坚赵宇谢良智张晓燕贾社娜王晖
Owner ACM RES SHANGHAI