Circuit board defect solder joint automatic identification device

Abstract

The invention discloses a device for automatically marking defective welding spots of a circuit board. The device comprises a circuit board delivering guide rail component, a circuit board delivering push frame component, an XY coordinate positioning and marking mechanism and a control system. The circuit board delivering guide rail component is used for placing the circuit board and allowing the same to linearly move forwardly in a slide manner. The circuit board delivering push frame component is used for pushing and delivering the circuit board. The XY coordinate positioning and marking mechanism is used for adjusting XY coordinate positions for dotting. The control system is used for controlling the circuit board delivering guide rail component, the circuit board delivering push frame component and the XY coordinate positioning and marking mechanism to operate. The circuit board delivering guide rail component, the circuit board delivering push frame component and the XY coordinate positioning and marking mechanism are respectively connected with the control system. The device using the open structure is simple in structure and convenient to maintain, human participation degree during production is reduced, manual mistakes can be avoided, production stability and accuracy can be increased, efficiency and quality of enterprise production are increased, and automatic production and informatization management of enterprises are promoted.

Description

technical field [0001] The invention relates to a circuit board defect solder joint marking device, in particular to a circuit board defect solder joint automatic marking device, which belongs to the technical field of circuit board marking. Background technique [0002] The continuous advancement of science and technology has gradually changed people's lifestyles, and various electronic products have been integrated into people's lives. With the reform and opening up, China has attracted a large-scale transfer of European and American manufacturing industries due to its preferential policies in terms of labor resources, markets, and investment. A large number of electronic product manufacturers have established factories in China. At the same time, China's home appliance industry and consumer electronics industry are developing rapidly, and the assembly lines of electronics factories need to produce a large number of circuit boards every day. According to the different ele...

AI Technical Summary

Problems solved by technology

Due to technical bottlenecks, this electronic component welding method is likely to cause two quality problems: (1) solder joints may have virtual soldering, missing soldering, or bridging; The relative force with the solder on the wave soldering machine can easily cause the component to shift or the distance between the bottom of the component and the circuit board to be too large

[0004] In the process of research and practice of the above method, it is found that it is too dependent on human experience, especially for solder joint quality problems, a skilled worker with certain experience is required to take up this position, while ordinary workers need special training, and in high-level Under intense labor, people's eyes are prone to fatigue, which makes quality control unable to be effectively guaranteed

In the current environment of rising labor costs and labor shortages in recent years, the method of manual inspection not only increases the cost of the enterprise, but also is inefficient and increases the difficulty of management. At the same time, it does not conform to the general trend of modern enterprise information management.

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