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Image sensor module and image capture module

An image sensor and module technology, applied in image communication, electrical solid-state devices, semiconductor devices, etc., can solve problems such as unstable electrical connections, increased pressure, and poor packaging quality, and achieve the goal of preventing excessive gas pressure Effect

Active Publication Date: 2014-03-12
TRIPLE WIN TECHSHENZHEN CO LTD +1
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  • Summary
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  • Claims
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AI Technical Summary

Problems solved by technology

However, during the environmental test of the image sensor, the conductive adhesive will release some gas after being heated, which will cause the pressure between the ceramic substrate and the bottom plate to increase, which may cause the ceramic substrate and the The base plate is separated, the electrical connection is unstable, and the packaging quality is poor

Method used

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  • Image sensor module and image capture module
  • Image sensor module and image capture module
  • Image sensor module and image capture module

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Embodiment Construction

[0014] Such as Figure 1-2 As shown, an image capturing module 100 provided by an embodiment of the present invention includes an image sensor module 200 and a lens module 300 fixed on the image sensor module 200 . The image sensor module 200 includes a bottom plate 10 , a conductive glue 20 , a ceramic substrate 30 , an image sensor 40 , a filler 50 and a filter 60 . The lens module 300 includes a lens base 70 and a lens 80 .

[0015] The bottom board 10 , namely the bottom circuit board device, includes a flexible circuit board 11 , an adhesive layer 12 and a reinforcement board 13 in this embodiment. The adhesive layer 12 is bonded between the flexible circuit board 11 and the reinforcement board 13 . The flexible circuit board 11 includes a first surface 111 and a second surface 112 opposite to the first surface 111 . A plurality of welding pads 113 are disposed on the first surface 111 . The reinforcement board 13 is bonded to the second surface 112 of the flexible ci...

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PUM

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Abstract

The invention provides an image sensor module. The image sensor module comprises a ceramic substrate, an image sensor, a conductive adhesive and a base plate, wherein the ceramic substrate comprises an upper surface, a lower surface, and a side surface connected between the upper surface and the lower surface; the lower surface is provided with an accommodating groove; the upper surface is provided with a light penetrating hole communicating with the accommodation groove; the side surface is provided with a gas vent communicating with the accommodation groove; the image sensor is accommodated in the accommodation groove and is electrically connected with the ceramic substrate; and the lower surface of the ceramic substrate is electrically connected with the base plate through the conductive adhesive. According to the invention, the ceramic substrate is provided with the gas vent communicating with the accommodation groove used for accommodating the image sensor therein so that gases between the ceramic substrate and the base plate can be released through the gas vent, thus the packaging quality is effectively improved. The invention also provides an image capture module applying the image sensor module.

Description

technical field [0001] The invention relates to an image sensor module and an image capturing module using the image sensor module. Background technique [0002] A conventional image sensor flip-chip package includes a ceramic substrate, an image sensor, and a bottom plate. The image sensor is electrically connected to the ceramic substrate in a flip-chip package. The ceramic substrate is electrically connected to The adhesive connection is fixed on the base plate and realizes electrical connection, and the image sensor is located between the ceramic substrate and the base plate. However, during the environmental test of the image sensor, the conductive adhesive will release some gas after being heated, which will cause the pressure between the ceramic substrate and the bottom plate to increase, which may cause the ceramic substrate and the The base plate is separated, the electrical connection is unstable, and the packaging quality is poor. Contents of the invention [...

Claims

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Application Information

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IPC IPC(8): H01L23/00H04N5/335H04N5/225
Inventor 陈信文
Owner TRIPLE WIN TECHSHENZHEN CO LTD
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