Circuit layout method and associated printed circuit board
A printed circuit board and circuit layout technology, applied in the directions of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problems of poor signal transmission quality and instability of electronic devices, improve signal quality control, and reduce material costs Effect
Inactive Publication Date: 2014-03-12
MSTAR SEMICON INC
View PDF9 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Another example: in the case of selecting the lowest cost among the traditional printed circuit boards, such as a two-layer printed circuit board, as the main circuit structure of an electronic device, the signal transmission quality of the electronic device is poor or unstable
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0036] figure 1 It is a schematic diagram of an electronic device 100 according to an embodiment of the present invention. The electronic device 100 may include a printed circuit board 100B and various components disposed on the printed circuit board 100B such as integrated circuits (Integrated Circuit, IC) 110 and 150 and a connector 130, wherein the printed circuit board 100B may include at least one set of transmission lines such as A first set of transmission lines 120 and a second set of transmission lines 140 , and the first set of transmission lines 120 is disposed between the integrated circuit 110 and the connector 130 , and the second set of transmission lines 140 is disposed between the integrated circuits 110 and 150 . This is for the purpose of illustration only, not limitation of the present invention. According to a variation of this embodiment, the aforementioned at least one set of transmission lines may include another set of transmission lines, wherein the ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
A circuit layout method for a printed circuit board (PCB) is provided. The method includes forming a pair of signal traces on the PCB, and disposing a ground trace between the pair of signal traces. The pair of signal traces and the ground trace are located at a same layer of the PCB, and the ground trace renders the pair of transmission traces to have predetermined impedance. An associated PCB is also provided. The PCB includes a circuit layer, and a ground layer for grounding. The circuit layer includes a pair of signal traces, and a ground grace disposed between the pair of signal traces. The circuit layer is different from the ground layer. Based on the circuit layout method and the associated PCB, an electronic apparatus not only complies with mobile high-definition link (MHL) requirements regarding impedance between signal traces but also offers reduced costs.
Description
technical field [0001] The present invention relates to signal quality control at an economical cost, in particular to a circuit layout method and related printed circuit boards. Background technique [0002] The technology of electronic circuits is quite mature, and there are many literatures that provide various signal processing methods for improving signal quality for reference; however, in practice, under the condition of strictly controlling the cost of materials, the traditional Electronic circuits are still insufficient for signal quality control. [0003] According to the related art, once the material cost of the main circuit structure is strictly controlled in the design stage of an electronic device, certain problems usually occur. For example: Insufficient signal processing components that can be used to improve signal quality, resulting in poor signal quality. Another example: the signal transmission speed of the electronic device is quite limited. Another e...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/09H05K3/00
CPCH05K1/025H05K1/0245H05K2201/09336G06F17/5068H05K1/0213H05K1/0219G06F30/394G06F30/39G06F2115/12
Inventor 余天华林士伟
Owner MSTAR SEMICON INC