Intelligent sensing method and system for electroplating line current abnormity

Abstract

The invention relates to the electroplating production field, and particularly relates to an intelligent sensing method and system for electroplating line current abnormity. The method comprises the following steps: obtaining a current value required for electroplating according to inputted electroplating current density, and electroplating parameters of a production panel; carrying out electroplating work according to the current value; detecting an electroplating voltage signal during the electroplating; calculating a theoretical voltage corresponding to the inputted electroplating current density according to the linear relation between the voltage and the electroplating current density; sampling and comparing the detected electroplating voltage signal with the theoretical voltage signal, and determining electroplating deviation when the detected electroplating voltage signal is larger than a certain set threshold of the theoretical voltage. According to the invention, by using the linear relation between the electroplating voltage and the current density, the electroplating voltage of an electroplating line is monitored during electroplating in a manner of electroplating current controlling; whether electroplating abnormity occurs is determined by comparing the real voltage with the set current density; and thus intelligent detection of electroplating current abnormity is realized.

Description

technical field [0001] The invention relates to the field of electroplating production, and more specifically, to an intelligent sensing method and system for abnormal current of an electroplating line. Background technique [0002] When electroplating copper on PCB in the PCB industry, because the electroplating voltage is small and the current is large, in order to ensure the accuracy of electroplating control, the method of constant current electroplating is generally adopted, that is, the operator inputs the electroplating current density, the electroplating area of ​​the production board and The electroplating parameters such as the number of production plates are sent to the main control computer, and the main control computer automatically calculates the theoretically required current. [0003] After the main control computer calculates the required current value, it sends the required current value signal to the corresponding rectifier. The rectifier senses and adjus...

AI Technical Summary

Problems solved by technology

[0004] Although this solution can calculate the current required for PCB electroplating, it still has some shortcomings: when the operator enters the wrong electroplating parameters such as the number, quantity, and area, or the current sensor is abnormal, the current deviation is serious, or several One of the electroplating wires was broken due to the mechanical swing during the electroplating process, and the main control system could not detect the above abnormal situation in time

Therefore, it will eventually cause a serious lack of copper plating for the material number A

[0010] However, PCB copper plating thickness inspection generally requires destructive slicing, so full inspection is not possible. If the PCB with insufficient copper plating is not found in time and flows into the subsequent process, it will cause extremely serious quality incidents.

Images