PCB substrate stamping device

A technology for punching and substrates, applied in the field of PCB substrate punching devices, can solve the problems of surface insulation layer and hole insulation layer cracks, failure of withstand voltage performance, etc., to avoid bursting, improve yield and production efficiency, and remove hidden quality hazards. Effect

Inactive Publication Date: 2014-03-26
恩达电路(深圳)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The invention provides a PCB substrate punching device to solve the problem that cracks may occur on the surface insulating layer and

Method used

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  • PCB substrate stamping device

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Example Embodiment

[0021] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings, but the present invention can be implemented in a variety of different ways defined and covered by the claims.

[0022] Please refer to figure 1 , The present invention provides a PCB substrate (especially double-sided sandwich aluminum substrate) punching device, comprising: a fixed lower mold portion and an upper mold portion that moves relative to the lower mold portion; the upper mold portion includes a shear plate 1, The upper mold core 2 and the upper mold ejection mechanism; the shear plate 1 includes a cavity, and the upper mold core 2 is movably arranged in the cavity; the upper mold ejection mechanism drives the upper mold core 2 to move relative to the cavity toward the lower mold part.

[0023] Please refer to figure 1 When punching the board, the PCB substrate 15 is placed in the gap between the upper mold part and the lower mold part. Then, ...

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Abstract

The invention provides a PCB substrate stamping device. The PCB substrate stamping device comprises a lower die portion and an upper die portion, wherein the lower die portion is fixedly arranged, and the upper die portion moves relative to the lower die portion. The upper die portion comprises a shearing plate, an upper die core and an upper die retreating mechanism. The shearing plate comprises a cavity, and the upper die core is movably arranged in the cavity. The upper die retreating mechanism drives the upper die core to move towards the lower die portion relative to the cavity. By the adoption of the structure, an insulating layer can be prevented from cracking, the rate of finished products and production efficiency are improved, potential quality hazards are eliminated, and the condition that poor high-pressure may occur after reflow soldering is avoided.

Description

technical field [0001] The invention relates to the field of printed circuit board manufacturing, in particular to a PCB substrate punching device. Background technique [0002] With the development of PCB and LED industries, the market demand for double-sided sandwich aluminum substrates is increasingly strong. The feature of this product is that the upper and lower sides of the aluminum substrate must be equipped with electronic components. It must withstand high voltage and also have a good heat dissipation function. If the above functions are to be satisfied at the same time, when punching the board, no insulation layer is allowed to burst. problem, otherwise the high-voltage test will fail; according to conventional methods, ordinary molds cannot meet the requirements, and at least one side of the insulation layer will burst. If the mold design is reasonable and no other actions are taken before punching to help the product reduce extrusion during the punching proc...

Claims

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Application Information

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IPC IPC(8): B21D35/00B21D37/10B21D37/12B21D45/04
Inventor 程有和余伟杭江泽港陈启涛贺培严
Owner 恩达电路(深圳)有限公司
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