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Vacuum sputtering coating target

A technology of vacuum sputtering and target material, applied in the field of target material, can solve the problems of thickening of the film layer, increase of test voltage, and more deposition of back-sputtering, so as to shorten the pre-sputtering time, improve the quality of the film, and improve the use of rate effect

Inactive Publication Date: 2014-03-26
光洋新材料科技(昆山)有限公司
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  • Abstract
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AI Technical Summary

Problems solved by technology

During the sputtering process, it was found that the voltage of the machine increased with time, resulting in thicker film layers, more sputtering deposits, increased test voltage, and a vicious cycle, which shortened the service life of the target. , reducing the utilization rate of the target

Method used

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  • Vacuum sputtering coating target
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Embodiment Construction

[0014] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.

[0015] see figure 2 , the vacuum sputtering coating target of the present invention includes a sputtering surface, and the sputtering surface includes a first horizontal plane 2 and a first slope surface 3 sequentially connected with the first horizontal plane 2, an increased sputtering surface 4, and a second slope surface 5 And the second level 6.

[0016] Use a high-precision milling machine to process the slope surface of the target. The first slope surface 3 and the first horizontal plane 2 form the first slope angle, and the second slope surface 5 and the second horizontal plane 6 form the second slope angle.

[0017] According to the sputtering trajectory of the target, the characteristics of the machine and the cost, set the first slope ...

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Abstract

The invention discloses a vacuum sputtering coating target, which comprises a sputtering coating surface, wherein the sputtering coating surface comprises a first horizontal plane (2), and a first slope surface (3), an elevated sputtering coating surface (4), a second slope surface (5) and a second horizontal plane (6) sequentially connected with the first horizontal plane (2); the first slope surface (3) and the first horizontal plane (2) form a first slope angle; and the second slope surface (5) and the second horizontal plane (6) form a second slope angle. According to the vacuum sputtering coating target, a magnetic field between the target and a base material can be adjusted through changing the shape and the thickness of the sputtering coating surface of the target, and the voltage is smooth and steady, so that the pre-sputtering coating time of the target is shortened, the utilization ratio of the target is improved, and the quality of a film is improved.

Description

technical field [0001] The invention relates to a vacuum sputtering coating target, which belongs to the technical field of targets. Background technique [0002] The vacuum sputtering coating target is accelerated and gathered into a high-speed ion flow in a vacuum by using the ions generated by the ion source in a vacuum magnetron environment, and bombards the surface of the target, so that the atoms on the surface of the target leave the target and deposit on the substrate. surface. [0003] The shape of the existing target is as follows figure 1 As shown, that is, the sputtering surface 1 is a plane, and the corresponding machine is controlled by a constant current, and the target is put into production after 1.5 hours of pre-sputtering. During the sputtering process, it was found that the voltage of the machine increased with time, resulting in thicker film layers, more sputtering deposits, increased test voltage, and a vicious cycle, which shortened the service life ...

Claims

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Application Information

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IPC IPC(8): C23C14/34
Inventor 陈春玲黄威智方家芳
Owner 光洋新材料科技(昆山)有限公司
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