Stress dispersion MEMS (Micro-Electro-Mechanical Systems) plastic package pressure sensor and preparation method thereof

Abstract

The invention discloses a stress dispersion MEMS (Micro-Electro-Mechanical Systems) plastic package pressure sensor and a preparation method thereof. The plastic package pressure sensor disclosed by the invention comprises a pressure chip, a pressure buffer layer, a base plate, a pin frame, conducting wires and a plastic package body, wherein a flexible glue thin film is covered on the upper surface of the pressure chip, and welding points of the pressure chip and the conducting wires are exposed to form the pressure buffer layer; a cavity is arranged between the plastic package body and the pressure buffer layer, and a through hole is formed between the cavity and the outer surface of the plastic package body and communicated with the outside. According to the stress dispersion MEMS plastic package pressure sensor and the preparation method thereof, the pressure buffer layer with the flexible glue thin film is adopted for covering a sensitive structure of the pressure chip, and the pressure during plastic injection is reduced through stress dispersion of the pressure buffer layer; moreover, the cavity with large area is arranged on the pressure buffer layer, and is beneficial to ventilating and radiating the pressure chip, so that the function that the performance of the pressure chip is complete and normal is ensured; the plastic package pressure sensor has the characteristics that the manufacturing technology is simple and advanced, the pressure chip is not influenced by stress, the performance is complete, the size is relatively smaller, the radiation is good, and the like.

Description

technical field [0001] The invention relates to microelectronic package technology, in particular to a stress dispersion MEMS plastic package pressure sensor and a preparation method thereof. Background technique [0002] The sensor package is a bridge connecting the sensor pressure chip and the electronic system. It usually refers to the module made of the sensor pressure chip and the substrate used to fix and protect it through thermosetting and thermoplastic materials. The connection between the silicon substrate of the pressure chip and the carrier or the shell is an important link not only for the integrated circuit but also for the sensor. [0003] Although the microelectronic packaging in the prior art provides protection for the pressure chip in terms of electrical, thermal, optical and mechanical properties, it cannot meet the ever-increasing performance requirements, reliability, heat dissipation and power of the pressure chip at a certain cost. Allocation and oth...

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Problems solved by technology

[0003] Although the microelectronic packaging in the prior art provides protection for the pressure chip in terms of electrical, thermal, optical and mechanical properties, it cannot meet the ever-increasing performance requirements, reliability, heat dissipation and power of the pressure chip at a certain cost. The need for functions such as allocation

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