Upwards-protruding needle magnetic fixing mechanism

Abstract

The invention relates to an upwards-protruding needle magnetic fixing mechanism, and belongs to the technical field of mechanical automation. The fixing mechanism comprises an upwards-protruding needle base and a guiding cover, and an upwards-protruding needle is arranged on the upwards-protruding needle base and vertically moves in a hole of the guiding cover. A magnet with weak magnetic force is installed at the bottom of the upwards-protruding needle base, and the upwards-protruding needle horizontally moves through the magnet. A magnetic fixing mode is adopted in the magnetic fixing mechanism, so that the upwards-protruding needle magnetic fixing mechanism is conveniently assembled and adjusted. The magnet only limits displacement of the upwards-protruding needle in the vertical direction, and the upwards-protruding needle can be adjusted in any horizontal direction within the scope of the magnet. Meanwhile, accuracy requirements for machining related parts are reduced, and therefore the machining cost is reduced. As mechanical limiting is eliminated, the related parts can be generally used, and the universality of the parts is improved.

Description

technical field [0001] The invention relates to a magnetic fixing mechanism for protruding needles, which belongs to the technical field of mechanical automation. Background technique [0002] In the semiconductor die loading equipment, the most important function is to take and stick the wafer. The smooth removal of the wafer from the wafer depends on the cooperation of the protrusion mechanism and the grasping mechanism. [0003] The protruding mechanism is to make the wafer to be taken away on the wafer higher than the wafer and other wafers, and to separate the wafer from the wafer. Only in this way can the grasping mechanism take the wafer away in a vacuum. [0004] The most important part that can complete the above actions is the protruding upper needle. There is a guide cover near the top of the protruding needle, and the protruding needle seat and the guide cover are respectively fixed on different parts, and the protruding needle will move up and down in the hole ...

AI Technical Summary

Problems solved by technology

[0005] Since the volume of the wafer is getting smaller and smaller, the diameter of the protruding pin must be made smaller, and the requirements for the cooperation of each component are higher. However, the protruding pin and the guide cover are not installed on the same part, and they are horizontal It cannot be adjusted, which increases the difficulty of matching, and the processing cost will inevitably rise accordingly

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