Pre-process method and structure of light-emitting diode packaging

A technology of light-emitting diodes and pre-processing, applied in the direction of electrical components, electric solid-state devices, circuits, etc., can solve problems such as damage to the packaging structure of light-emitting diodes, embrittlement of the reflective base 60, and reduced luminous efficiency, so as to reduce the damage rate , reduce production cost, increase the effect of contact area

Inactive Publication Date: 2016-08-17
CHANG WAH ELECTROMATERIALS INC +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, most of the existing reflective bases 60 are made of thermosetting materials. Therefore, the high temperature generated by the light-emitting diode chip after long-term operation cannot effectively conduct and dissipate heat through the reflective base 60. Therefore, the reflective base 60 is prone to The embrittlement phenomenon not only reduces the luminous efficiency, but also causes damage to the packaging structure of the LED for a long time, increasing the production cost

Method used

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  • Pre-process method and structure of light-emitting diode packaging
  • Pre-process method and structure of light-emitting diode packaging
  • Pre-process method and structure of light-emitting diode packaging

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Embodiment Construction

[0065] The present invention is further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.

[0066] like figure 2 As shown, punching 10 is performed on the reflector cup base material 200 which is copper foil, so as to form two or more openings in the form of a rectangular array and in the form of hollow cylinders or indented bevels on the reflector cup base material 200 201, then, mechanically roughening 11 is performed on the bottom surface of the reflector base material 200, so that a rough surface 202 is formed on the bottom surface of the reflector cup base material 200 to increase the contact area. The rough surface 202 is further subjected to chemical roughening 11' (the process of blackening and browning is carried out by grinding with chemical polishing liquid, oxidizing ...

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Abstract

The invention discloses a pre-manufacturing method and a pre-manufactured structure for an LED package. The pre-manufactured structure of the LED package is manufactured mainly through the steps of stamping, coarsening, mold sealing, sticking, electroplating and the like. The pre-manufactured structure comprises a reflection cup rack, an insulation layer and a wire frame which are stuck together in sequence from the top down, wherein the reflection cup can resist high temperature generated by an LED in long-term operation, provides the superexcellent effects of heat conducting and extracting, and prolongs the service life of the LED; besides, the high-temperature-resist insulation layer ensures that the pre-manufactured structure can resist heat and is less susceptible to cracking and embrittling, thereby reducing the damage rate and use cost of the pre-manufactured structure of the LED package.

Description

technical field [0001] The invention relates to a pre-fabrication method and structure of a light-emitting diode package, in particular to a pre-fabrication structure of a light-emitting diode package fabricated by punching, roughening, molding, laminating, electroplating and other fabrication techniques. Background technique [0002] With the advancement of science and technology and civilization, the production technology of light-emitting diodes has gradually matured, and its application fields are quite extensive, which makes the market demand relatively increase. [0003] like figure 1 As shown, the package structure 6 of the existing light-emitting diode is composed of a reflective base 60 and a lead frame 61 that are in contact with each other at the top and the bottom. The lead frame 61 inside the reflective base 60 is encapsulated with a light-emitting diode chip 62. A metal reflective layer 63 is plated on the upper surface and inner sidewall of the reflective bas...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/60H01L33/62H01L33/48
CPCH01L2224/48091H01L2224/97
Inventor 黄嘉能
Owner CHANG WAH ELECTROMATERIALS INC
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