Pre-process method and structure of light-emitting diode packaging

Abstract

The invention discloses a pre-manufacturing method and a pre-manufactured structure for an LED package. The pre-manufactured structure of the LED package is manufactured mainly through the steps of stamping, coarsening, mold sealing, sticking, electroplating and the like. The pre-manufactured structure comprises a reflection cup rack, an insulation layer and a wire frame which are stuck together in sequence from the top down, wherein the reflection cup can resist high temperature generated by an LED in long-term operation, provides the superexcellent effects of heat conducting and extracting, and prolongs the service life of the LED; besides, the high-temperature-resist insulation layer ensures that the pre-manufactured structure can resist heat and is less susceptible to cracking and embrittling, thereby reducing the damage rate and use cost of the pre-manufactured structure of the LED package.

Description

technical field [0001] The invention relates to a pre-fabrication method and structure of a light-emitting diode package, in particular to a pre-fabrication structure of a light-emitting diode package fabricated by punching, roughening, molding, laminating, electroplating and other fabrication techniques. Background technique [0002] With the advancement of science and technology and civilization, the production technology of light-emitting diodes has gradually matured, and its application fields are quite extensive, which makes the market demand relatively increase. [0003] like figure 1 As shown, the package structure 6 of the existing light-emitting diode is composed of a reflective base 60 and a lead frame 61 that are in contact with each other at the top and the bottom. The lead frame 61 inside the reflective base 60 is encapsulated with a light-emitting diode chip 62. A metal reflective layer 63 is plated on the upper surface and inner sidewall of the reflective bas...

AI Technical Summary

Problems solved by technology

[0004] However, most of the existing reflective bases 60 are made of thermosetting materials. Therefore, the high temperature generated by the light-emitting diode chip after long-term operation cannot effectively conduct and dissipate heat through the reflective base 60. Therefore, the reflective base 60 is prone to The embrittlement phenomenon not only reduces the luminous efficiency, but also causes damage to the packaging structure of the LED for a long time, increasing the production cost

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