Method for preparing gold-phase section samples aiming at embedded printed-circuit board
A printed circuit board and metallographic sectioning technology, which is applied in the preparation of test samples and sampling devices, can solve the problems of deformation, excessive grinding, and bending of sliced samples, so as to reduce testing costs, ensure stability and Consistency, the effect of improving detection efficiency
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[0024] The present invention will be further described in detail below in conjunction with specific embodiments and drawings.
[0025] The method for preparing a metallographic slice sample of a 4-layer embedded capacitor printed circuit board includes the following steps:
[0026] Step 1. Choose a FR-4 substrate material with a thickness of 3mm and cut it into a 5×5cm metallographic section reinforcement support plate; first, the surface of the FR-4 substrate is polished and roughened with P120 sandpaper, and then cleaned in a cleaning solution , Then rinse with deionized water, and finally put it in an oven at 120°C for 30 minutes;
[0027] Step 2. Take the 4-layer embedded capacitor PCB board to be tested, cut it into a shape of 5×5cm with scissors, determine the sampling area to be tested and mark it;
[0028] Step 3. Place the roughened and clean FR-4 substrate material reinforced support plate on the surface of the horizontal platform, and evenly coat a layer of α-ethyl cyanoacr...
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