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Method for preparing gold-phase section samples aiming at embedded printed-circuit board

A printed circuit board and metallographic sectioning technology, which is applied in the preparation of test samples and sampling devices, can solve the problems of deformation, excessive grinding, and bending of sliced ​​samples, so as to reduce testing costs, ensure stability and Consistency, the effect of improving detection efficiency

Inactive Publication Date: 2014-04-02
UNIV OF ELECTRONIC SCI & TECH OF CHINA
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Solve the problems of deformation, bending and excessive grinding of sliced ​​samples during the preparation of metallographic slice samples of embedded printed circuit boards, effectively reduce the inspection cost of embedded printed circuit boards, improve the detection efficiency and the accuracy and reliability of detection results sex

Method used

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  • Method for preparing gold-phase section samples aiming at embedded printed-circuit board
  • Method for preparing gold-phase section samples aiming at embedded printed-circuit board

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Embodiment Construction

[0024] The present invention will be described in further detail below in conjunction with specific embodiments and accompanying drawings.

[0025] A method for preparing a metallographic section sample of a 4-layer embedded capacitor printed circuit board, comprising the steps of:

[0026] Step 1. Select a piece of FR-4 substrate material with a thickness of 3mm, and cut it into a metallographic slice reinforced support plate of 5×5cm; first, roughen the surface of the FR-4 substrate with P120 sandpaper, and then put it into the cleaning solution for cleaning , and then cleaned with deionized water, and finally dried in an oven at 120°C for 30 minutes;

[0027] Step 2. Take the 4-layer embedded capacitor PCB board to be tested, cut it into a 5×5cm shape with scissors, determine the sampling area to be tested and mark it;

[0028] Step 3. Place the roughened and clean FR-4 substrate material reinforced support plate on the horizontal platform, and evenly coat a layer of α-cya...

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Abstract

The invention aims at an embedded printed-circuit board and provides a method for preparing gold-phase section samples. The method comprises the following steps of attaching the embedded printed-circuit board to be detected on the surface of a strengthening support board, and successively cutting samples, sealing glue and carrying out cast pouring, analyzing samples by a gold phase, grinding, polishing, and carrying out microetching and other processes to obtain the gold-phase section samples. The method provided by the invention has the advantages that the problems that the samples are directly cut to result in deformation of the section samples, bending of the section samples in the glue sealing and cast pouring process, and easily excessive grinding in the grinding process and other problems in a preparation process of the gold-phase section samples of the burying embedded printed-circuit board are solved, the stability and the consistency of the gold-phase section samples are guaranteed, the detection cost of the embedded printed-circuit board is effectively reduced, and the detection efficiency and the accuracy and the reliability of a detection result are improved.

Description

technical field [0001] The invention belongs to the field of printed circuit board manufacturing, relates to printed circuit board (Printed Circuit Board, referred to as PCB) quality inspection, and specifically provides a method for preparing metallographic section samples for embedded printed circuit boards. Background technique [0002] In the field of printed circuit board manufacturing, printed circuit board quality inspection is an essential process. In the initial stage of printed circuit board production, most of the products are simple single-sided boards and double-sided boards, and the line width and line spacing are very large. The actual needs of the enterprise's quality inspection can be met by using visual inspection technology, supplemented by an amplification device when necessary. With the popularization of technologies such as multi-layer boards and elaborate circuits, reliable information must be obtained with the help of special PCB testing instruments a...

Claims

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Application Information

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IPC IPC(8): G01N1/06G01N1/28
Inventor 王守绪范海霞何为周国云陶志华冀林仙
Owner UNIV OF ELECTRONIC SCI & TECH OF CHINA
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