A high-brightness GaN-based light-emitting diode epitaxial growth method
A technology of light-emitting diodes and epitaxial growth, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of radiation recombination number and quantum confinement effect reduction, luminous intensity reduction, volume increase, etc., to achieve the formation of inhibition, reduction Compensation effect, effect of improving crystal quality
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[0030] A high-brightness GaN-based light-emitting diode epitaxial growth method, comprising the following specific steps:
[0031] Step 1: Clean the substrate at a high temperature for 5-20 minutes in a hydrogen atmosphere at 1000-1200°C, and then perform nitriding treatment. The substrate is a material suitable for the growth of GaN-based semiconductor epitaxial materials, such as sapphire, GaN and silicon carbide (SiC ) single crystal, etc.;
[0032] Step 2, lowering the temperature to 500-650°C, growing a low-temperature GaN buffer layer with a thickness of 20-30nm, controlling the growth pressure between 300-760 Torr, and controlling the V / III ratio to 10-1200;
[0033] Step 3: After the growth of the low-temperature GaN buffer layer is completed, the introduction of trimethylgallium (TMGa) is stopped, the substrate temperature is raised to between 900-1200°C, and in-situ thermal annealing is performed on the low-temperature GaN buffer layer , the annealing time is 5-30mi...
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