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High-brightness surface mount device light-emitting diode

A light-emitting diode, high-brightness technology, applied in electrical components, circuits, semiconductor devices, etc., can solve problems such as poor heat dissipation, low brightness, and short service life

Inactive Publication Date: 2014-04-09
SUZHOU CHENGYUAN PHOTOELECTRIC TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is that the existing chip-type light-emitting diodes have problems such as low brightness and poor heat dissipation, which lead to short service life
The high-brightness chip light-emitting diode of the present invention solves the problems of low brightness and poor heat dissipation of the chip-type light-emitting diode in the prior art through simple structural changes, and prolongs the service life of the diode

Method used

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Embodiment Construction

[0011] The preferred technical solutions of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0012] As shown in the figure, the high-brightness SMD light-emitting diode of the present invention includes a PCB bracket 1, a reflective cup 2 and a blue light chip 3, the PCB bracket 1 is made of a plate, and the reflective cup 2 is installed on the PCB bracket 1 Above, the blue light chip 3 is installed on the bottom of the reflective cup 2, the blue light chip 3 is a blue light chip with a rough surface and a single PAD solder joint, and a high thermal conductivity cooling plate 4 is also arranged at the bottom of the PCB bracket 1 , wherein the plate thickness of the PCB bracket 1 is 0.1-0.5mm; the angle between the two sides of the reflective cup 2 is 90°, the blue light chip 3 includes a wafer, and the wafer is in the 472.5-473 wave band The wafer is provided with a layer of multi-powder mixed coating on the surface of th...

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Abstract

The invention discloses a high-brightness surface mount device light-emitting diode. The high-brightness surface mount device light-emitting diode comprises a PCB support, a reflection cup and a blue light chip. The PCB support is made of sheet materials, the reflection cup is installed on the PCB support, the blue light chip is installed at the bottom of the reflection cup, the blue light chip is a surface-roughened single-PAD-welding-point blue light chip, and a high-heat-conduction heat dissipation board is further arranged at the bottom of the PCB support. According to the high-brightness surface mount device light-emitting diode, due to the fact that the PCB support is made of the sheet materials and the high-heat-conduction heat dissipation board is arranged at the bottom of the PCB support, the heat dissipation problem of the high-brightness surface mount device light-emitting diode is further solved, and the brightness of the diode is improved through the surface-roughened single-PAD-welding-point blue light chip. The high-brightness surface mount device light-emitting diode solves the problems that a surface mount device light-emitting diode in the prior art is not high in brightness and is poor in heat dissipation through simple structural changing and the service life of the diode is prolonged.

Description

technical field [0001] The invention relates to the technical field of LED lighting, in particular to a high-brightness patch light-emitting diode. Background technique [0002] With the widespread use of light-emitting diodes, people have gradually gained a deeper understanding of the characteristics, advantages and disadvantages of light-emitting diodes. The current light-emitting diodes mainly include in-line type, patch type, glue-filled patch type and high-power type. The LED chip is a solid-state semiconductor device that converts electricity directly into light. The heart of the SMD LED is a semiconductor wafer. One end of the wafer is attached to a bracket, one end is the negative pole, and the other end is connected to the positive pole of the power supply, so that the entire wafer is encapsulated by epoxy resin. [0003] The existing chip-type light-emitting diodes generally have problems such as low brightness and poor heat dissipation, which lead to sho...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/60H01L33/64
CPCH01L33/486H01L33/62H01L33/644
Inventor 戴岳平
Owner SUZHOU CHENGYUAN PHOTOELECTRIC TECH
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