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Synthetic sensor for particle impact noise detection (PIND) device

A technology for synthesizing sensors and testing equipment, which is applied in instruments, measuring devices, scientific instruments, etc., can solve the problems of short service life of acoustic emission sensors, easy damage of electromagnetic shielding wires, and low efficiency of testing and testing, so as to reduce testing capacity and difficulty, The effect of reducing the test intensity and shortening the detection time

Inactive Publication Date: 2014-04-16
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] The purpose of the present invention is to solve the problems of low efficiency, poor effect, short service life of the acoustic emission sensor, and easy damage of the electromagnetic shielding wire in the existing redundant object detection test, and further provide a device that is fixed in the jig and is easy to receive acceleration signals and acoustic emission signals. High-sensitivity synthetic sensor that has the functions of both an acceleration sensor and an acoustic emission sensor

Method used

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  • Synthetic sensor for particle impact noise detection (PIND) device
  • Synthetic sensor for particle impact noise detection (PIND) device
  • Synthetic sensor for particle impact noise detection (PIND) device

Examples

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specific Embodiment approach 1

[0020] Specific implementation mode one: combine Figure 1 to Figure 12 Describe this embodiment mode, this embodiment mode includes a kind of composite sensor for PIND detection equipment, this composite sensor comprises acoustic emission sensitive element 1, sensitive part cavity 2, coupling stage 3, mass block 6, acceleration sensitive element 7, fixed Bottom cover 9, connecting piece 10, flexible circuit board 11, binding post fixing platform 12 and binding post fixing seat 13; the acoustic emission sensitive element 1 is pasted on the back of the coupling stage 3 and is located inside the sensitive part cavity 2, and the sensitive part The cavity 2 and the coupling stage 3 are integrally formed, the connector 10 fastens the bottom cover 9 and one end of the flexible circuit board 11 to the cavity 2 of the sensitive part, and the terminal post 13 is welded to the other end of the flexible circuit board 11 , the terminal fixing seat 13 and the flexible circuit board 11 are ...

specific Embodiment approach 2

[0023] Specific implementation mode two: combination figure 1 To illustrate this embodiment, the acoustic emission sensitive element 1 is made of piezoelectric ceramics and bonded to the coupling stage 3 through rubber parts 16. The piezoelectric ceramics are cylindrical, and the electrodes of the piezoelectric ceramics are made of silver. , The material of the acceleration sensitive element 7 is piezoelectric ceramics. . Other compositions and connections are the same as in the first embodiment.

specific Embodiment approach 3

[0024] Specific implementation mode three: combination figure 2 To illustrate this embodiment, the input end 57 of the flexible circuit board 11 in this embodiment is disc-shaped and has a hole in the center, and the output end 55 of the flexible circuit board 11 is rectangular and has holes at both ends. The input terminal 57 of the flexible circuit board 11 is disc-shaped and has a hole in the center, which is used for the passage of the hexagon socket head screw. The output terminal 55 of the circuit board 11 is rectangular and has holes at both ends for screw fixing. There are five pads in the middle of the hole for connecting wires carrying acoustic emission signals, acceleration signals and ground signals respectively. The material of the flexible circuit board 11 is preferably soft, tough, impact-resistant, well-conducted, and stable, so as to ensure reliable connection and conduction under the vibration and impact of the vibrating table. Other compositions and connec...

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Abstract

A synthetic sensor for a particle impact noise detection (PIND) device relates to a synthetic sensor. The synthetic sensor solves the problem that the existing redundancy detection test is low in efficiency and poor in effect, an acoustic emission sensor is short in service life, an electromagnetic shielded wire is easy to damage and the like. The synthetic sensor comprises an acoustic emission sensitive element 1, a sensitive piece cavity 2, a coupling objective table 3, a mass block 6, an acceleration sensitive element 7, a fixed base cover 9, a connection piece 10, a flexible circuit board 11, a binding post fixing table 12 and a binding post fixed seat 13. The acoustic emission sensitive element 1 is bonded to the back of the coupling objective table 3 and located in the sensitive piece cavity 2, the sensitive piece cavity 2 and the coupling objective table 3 are integrally formed, one end of the fixed base cover 9 and one end of the flexible circuit board 11 are fastened on the sensitive piece cavity 2 through the connection piece 10, and a binding post 13 is welded to the other end of the flexible circuit board 11. The sensor is suitable for the PIND detection device.

Description

technical field [0001] The invention belongs to the technical field of PIND detection, in particular to a synthetic sensor for PIND detection equipment. Background technique [0002] PIND (Particle Impact Noise Detection Technology) detection equipment is based on particle impact noise detection technology and is used in aerospace, defense electronics and other fields to detect and discriminate redundant particles of electronic components and electronic equipment. Due to the influence of the manufacturing process of domestic machinery and materials, the production level of processing and assembly, it is easy to keep some wire debris, metal particles, hair and other redundant substances in the cavity of electronic components or integrated circuits, which makes the entire electronic system have serious problems. security risks. PIND detection equipment can efficiently, quickly and conveniently detect redundant objects in the cavity of electronic components, and is widely used...

Claims

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Application Information

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IPC IPC(8): G01V1/00G01H11/08
Inventor 陈金豹赵国强戚乐牛鹏飞李超郭亮梁安生姜楠钱鑫翟国富
Owner HARBIN INST OF TECH
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