Modular molding method for light resistance wall structure
A structural module and photoresist technology, applied in optics, components for photomechanical processing, instruments, etc., can solve the problems of photoresist wall delamination, low rigidity of photoresist material, strong water absorption, etc., and achieve flexibility Rapid production, reduced processing costs, and improved production efficiency
Active Publication Date: 2014-04-16
NAT CENT FOR ADVANCED PACKAGING
View PDF4 Cites 1 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
The main problem of using photoresist to make the photoresist wall structure is that the photoresist material itself has small rigidity, large thermal expansion coefficient, and strong water absorption. In the subsequent baking process and reliability test, photoresist wall delamination or delamination from the glass often occurs. The phenomenon of shedding seriously affects product quality and service life
At the same time, the residue after exposure and development can easily lead to reliability problems of the sensor
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0029] The present invention will be further described below in conjunction with drawings and embodiments.
[0030] The present invention is aimed at figure 1 The principle of the shown photoresist wall structure with a regular array structure is: divide the structure into a certain number of identical unit structures 1, such as figure 2 , as shown in 3, first make several square unit structures 1, each unit structure 1 has a boss 2 and a groove 3 of the photoresist wall, and multiple unit structures 1 can be spliced together to obtain an overall photoresist wall structure graphics, such as Figure 4 shown. Finally, the splicing is cut as a whole to obtain a Figure 5 Shaped photoresist wall structure (eg circular).
[0031] Concrete implementation steps of the present invention are as follows:
[0032] (1) The regularly arranged photoresist wall structure layout is divided into several identical unit structures, and the resulting unit structure is smaller than the ove...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| surface smoothness | aaaaa | aaaaa |
| transmittivity | aaaaa | aaaaa |
Login to View More
Abstract
The invention provides a modular molding method for a light resistance wall structure with regular array structure. The layout of the light resistance wall structure is divided into a plurality of identical unit structures. The modular molding method comprises the following steps: firstly, the unit structures are manufactured, wherein each unit structure is provided with bosses and grooves of a light resistance wall; the unit structures are spliced together, so that an integral light resistance wall structure graph can be obtained; finally, the spliced integral light resistance wall structure graph is cut to obtain the light resistance wall structure with the required shape. The modular molding method has the advantages as follows: 1, the production efficiency of the light resistance wall structure can be improved by using the injection molding method; 2, the complex cavity structure is divided into the identical unit structures, and the unit structures are aligned and spliced, so that the complex cavity structure can be produced flexibly and quickly, and further the processing cost for integrally molding is lowered.
Description
technical field [0001] The invention relates to a modular forming method for a photoresist wall structure, which belongs to the technical field of semiconductor manufacturing. Background technique [0002] The photoresist wall photomask currently used in image sensors is made by spin-coating photoresist on a glass wafer, and forming a regularly arranged photoresist wall structure on the photoresist through exposure and development, such as figure 1 shown. The main problem of using photoresist to make the photoresist wall structure is that the photoresist material itself has small rigidity, large thermal expansion coefficient, and strong water absorption. In the subsequent baking process and reliability test, photoresist wall delamination or delamination from the glass often occurs. The phenomenon of shedding seriously affects product quality and service life. At the same time, the residue after exposure and development can easily lead to reliability problems of the sensor....
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): G03F1/68H01L27/146B29C45/00
Inventor 徐成于大全李昭强姜峰
Owner NAT CENT FOR ADVANCED PACKAGING