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An electrostatic stiffness type silicon microresonant acceleration sensor chip

An acceleration sensor and stiffness technology, applied in the direction of speed/acceleration/shock measurement, measurement acceleration, instruments, etc., can solve the problems of difficulty in eliminating the influence and inability to realize the bilateral drive of the vibrating beam.

Inactive Publication Date: 2016-04-27
INST OF ELECTRONICS ENG CHINA ACAD OF ENG PHYSICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, the driving comb capacitor can only drive the vibrating beam on one side, and cannot realize the bilateral driving of the vibrating beam. The parallel plate capacitance of electrostatic stiffness is introduced, so that the impact on electrostatic stiffness needs to be considered when designing the resonant frequency detection circuit of the vibrating beam

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  • An electrostatic stiffness type silicon microresonant acceleration sensor chip
  • An electrostatic stiffness type silicon microresonant acceleration sensor chip
  • An electrostatic stiffness type silicon microresonant acceleration sensor chip

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Embodiment Construction

[0017] figure 1 It is a schematic diagram of the overall structure of the silicon micro-resonant acceleration sensor chip with electrostatic stiffness of the present invention. Resonant type silicon micro-acceleration sensor chip concrete structural scheme of the present invention is as figure 1 shown. The sensor chip is mainly composed of a mass block 305, a fixed support vibrating beam (102, 402), a number of drive comb fixed plates connected to anchor points (103, 112, 115, 124, 403, 404, 406, 408), and anchor points. Points (601, 501) are connected to each other to form a plurality of detection parallel plate capacitance fixed plates. Rectangular pole plate 120 is connected with fixed support vibrating beam 102, and rectangular pole plate 312 is connected with fixed support vibrating beam 402, and rectangular pole plate (303,312) is linked with mass block 305, like this, in fixed support vibrating beam 102 and mass block 305 A group of parallel plate capacitors are form...

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Abstract

The invention provides a static stiffness type silicon micro resonance acceleration sensor chip. The sensor chip comprises two clamped vibration beams, driving comb tooth capacitor fixing pole plates, detection parallel plate capacitor fixing pole plates and a mass block. The mass block is arranged between the two clamped vibration beams, a set of parallel pole plates on the clamped vibration beams and one set of parallel pole plates on the mass block form a parallel plate capacitor for introducing static stiffness to the clamped vibration beams, and the other set of parallel pole plates on the clamped vibration beams and the detection parallel plate capacitor fixing pole plates form a detection parallel plate capacitor. In the process of working, the clamped vibration beams conduct double-side driving and form closed loop resonance through the detection parallel plate capacitor and a driving circuit, direct-current bias voltages are exerted between parallel plate capacitance pole plates between the clamped vibration beams and the mass block, and then the additional static stiffness is introduced to the clamped vibration beams. When acceleration effect exists, the mass block is shifted to enable the static stiffness of one clamped vibration beam to be increased, the resonant frequency of one clamped vibration beam is reduced, the static stiffness of the other clamped vibration beam is decreased, resonant frequency of the other clamped vibration beam is increased, and the resonance frequency difference and the acceleration of the two clamped vibration beams form direct ratios. The sensor outputs the frequency difference of the two clamped vibration beams, and the chip has the advantages of being strong in capacity of resisting disturbance, high in precision, convenient to use and the like.

Description

technical field [0001] The invention relates to an electrostatic stiffness type silicon micro-resonance acceleration sensor chip. Background technique [0002] If the vibrator is connected to one plate of the parallel plate capacitor and there is a DC bias voltage V between the plates of the parallel plate capacitor b , the vibration of the vibrator will cause the electrostatic force between the parallel plates to change, and there is an electrostatic force component proportional to the vibration displacement, which is equivalent to introducing an additional electrostatic stiffness to the vibrator , where ε is the dielectric constant, A is the effective area of ​​the parallel plate capacitor, g 0 is the parallel-plate capacitance gap corresponding to the equilibrium position. If the inertial force of the mass block under the action of acceleration changes g 0 , the electrostatic stiffness will change, thereby changing the resonant frequency of the vibrator, and the accel...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01P15/125
Inventor 张凤田何晓平施志贵
Owner INST OF ELECTRONICS ENG CHINA ACAD OF ENG PHYSICS