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laser processing machine

A laser processing machine and processing head technology, which is applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of excessive irradiation, difficulty in constant, discoloration of the end, etc., to improve cutting quality, reduce discoloration, and reduce work volume effect

Active Publication Date: 2015-08-19
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, since the laser is repeatedly irradiated near the processing end, the laser is irradiated excessively, causing discoloration of the end portion, which poses a problem in terms of quality.
[0004] The groove width in laser processing varies depending on the set cutting conditions or the influence of the surrounding environment, so it is difficult to keep constant
Therefore, the NC program cannot be programmed to stop laser irradiation at the timing when the end material is cut off.

Method used

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Embodiment approach 1

[0025] figure 1 It is a figure which shows the structure of Embodiment 1 of the laser processing machine concerning this invention. The laser processing machine 100 has an NC unit 10, a sensor data processing unit 18, a distance sensor 19, an X servo control unit 20, a Y servo control unit 21, a Z servo control unit 22, an X servo motor 23, a Y servo motor 24, and a Z servo motor. 25. Laser oscillator 26 and gas control device 27. The NC unit 10 has a main control unit 13 , a processing machine control unit 14 , a position control unit 15 , and a profiling control unit 17 .

[0026] The distance sensor 19 measures the distance L between the nozzle 28 and the workpiece 12 . There are many ways of the distance sensor 19 , and in the following description, the case of a capacitive sensor is taken as an example. However, of course, sensors other than capacitive sensors such as optical sensors may also be used. The sensor data processing unit 18 samples sensor data (a voltage v...

Embodiment approach 2

[0042] The configuration of the second embodiment of the laser processing machine according to the present invention is the same as that of the first embodiment. Figure 7 It is a flowchart showing the flow of operations during inner hole processing by the laser processing machine 100 according to the second embodiment. In the operation of this embodiment, the machining conditions are not changed in the vicinity of the machining end. That is, become will be with image 3 The operations corresponding to the processing in steps S101 and S102 are omitted, and the processing in steps S201 to S204 is the same as the processing in steps S103 to S106 in the first embodiment.

[0043] In this embodiment, if the operation cycle of the sensor data processing unit 18 is shorter than the oscillation cycle in normal laser processing, even if the processing conditions are not changed, it can be detected immediately after the end material 12a has been cut off. The laser oscillation is stop...

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Abstract

A laser machining apparatus includes a main control unit executing NC program; a laser oscillator oscillating laser light according to instruction from the main control unit; a distance sensor measuring distance L between a nozzle and a workpiece; a sensor-data processing unit sampling a measured value of the distance sensor; and a copying control unit moving a machining head to maintain the distance constant based the measured value, wherein the sensor-data processing unit samples the measured value with an operation period shorter than that of the main control unit and, when a portion corresponding to the through hole in the workpiece comes off and the distance becomes larger than a predetermined value during the inner hole machining, causes oscillation of laser light to be stopped by outputting a stop signal to the laser oscillator.

Description

technical field [0001] The invention relates to a laser processing machine. Background technique [0002] The inner hole processing by laser processing is to set the processing start point on the part that is cut off as the end material, cut from the processing start point toward the part that is the edge of the through hole, and irradiate along the edge. performed by laser. [0003] In laser processing, although the cutting groove is thin, it still has a width, and the force is applied to the material to be cut by the gas pressure ejected from the processing nozzle. Therefore, the timing when the end material side is cut off during inner hole processing ( timing) is earlier than the timing at which the nozzle reaches the end of the machining path. Therefore, since the laser beam is repeatedly irradiated in the vicinity of the processing end, the irradiation of the laser beam is excessive, and the end portion is discolored, which poses a problem in terms of quality. [00...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/382B23K26/00B23K26/08
CPCB23K26/08B23K26/0665B23K26/38G05B2219/45041
Inventor 井上孝
Owner MITSUBISHI ELECTRIC CORP