laser processing machine
A laser processing machine and processing head technology, which is applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of excessive irradiation, difficulty in constant, discoloration of the end, etc., to improve cutting quality, reduce discoloration, and reduce work volume effect
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Embodiment approach 1
[0025] figure 1 It is a figure which shows the structure of Embodiment 1 of the laser processing machine concerning this invention. The laser processing machine 100 has an NC unit 10, a sensor data processing unit 18, a distance sensor 19, an X servo control unit 20, a Y servo control unit 21, a Z servo control unit 22, an X servo motor 23, a Y servo motor 24, and a Z servo motor. 25. Laser oscillator 26 and gas control device 27. The NC unit 10 has a main control unit 13 , a processing machine control unit 14 , a position control unit 15 , and a profiling control unit 17 .
[0026] The distance sensor 19 measures the distance L between the nozzle 28 and the workpiece 12 . There are many ways of the distance sensor 19 , and in the following description, the case of a capacitive sensor is taken as an example. However, of course, sensors other than capacitive sensors such as optical sensors may also be used. The sensor data processing unit 18 samples sensor data (a voltage v...
Embodiment approach 2
[0042] The configuration of the second embodiment of the laser processing machine according to the present invention is the same as that of the first embodiment. Figure 7 It is a flowchart showing the flow of operations during inner hole processing by the laser processing machine 100 according to the second embodiment. In the operation of this embodiment, the machining conditions are not changed in the vicinity of the machining end. That is, become will be with image 3 The operations corresponding to the processing in steps S101 and S102 are omitted, and the processing in steps S201 to S204 is the same as the processing in steps S103 to S106 in the first embodiment.
[0043] In this embodiment, if the operation cycle of the sensor data processing unit 18 is shorter than the oscillation cycle in normal laser processing, even if the processing conditions are not changed, it can be detected immediately after the end material 12a has been cut off. The laser oscillation is stop...
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