Laser cutting machine
A laser processing machine and laser technology, used in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of excessive irradiation, difficulty in constant, discoloration at the end, and improve cutting quality, reduce workload, and reduce discoloration. Effect
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Embodiment approach 1
[0025] figure 1 It is a figure which shows the structure of Embodiment 1 of the laser processing machine which concerns on this invention. The laser processing machine 100 includes an NC unit 10 , a sensor data processing unit 18 , a distance sensor 19 , an X servo control unit 20 , a Y servo control unit 21 , a Z servo control unit 22 , an X servo motor 23 , a Y servo motor 24 , and a Z servo motor 25. Laser oscillator 26 and gas control device 27. The NC unit 10 includes a main control unit 13 , a processing machine control unit 14 , a position control unit 15 , and a copy control unit 17 .
[0026] The distance sensor 19 measures the distance L between the nozzle 28 and the workpiece 12 . There are various types of the distance sensor 19, and in the following description, the case of a capacitive sensor is taken as an example. However, of course, other than capacitive sensors such as optical sensors can also be used. The sensor data processing unit 18 samples sensor dat...
Embodiment approach 2
[0042] The configuration of the second embodiment of the laser processing machine according to the present invention is the same as that of the first embodiment. Figure 7 It is a flowchart which shows the operation flow at the time of inner hole processing of the laser processing machine 100 which concerns on Embodiment 2. FIG. In the operation of the present embodiment, the machining conditions are not changed in the vicinity of the machining end. That is, to become the image 3 The operations corresponding to steps S101 and S102 in the above are omitted, and the processes in steps S201 to S204 are the same as the processes in steps S103 to S106 in the first embodiment.
[0043] In the present embodiment, if the operation cycle of the sensor data processing unit 18 is shorter than the oscillation cycle in normal laser processing, even without changing the processing conditions, it is possible to quickly detect that the end material 12a is cut off. The laser oscillation is ...
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