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Laser cutting machine

A laser processing machine and laser technology, used in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of excessive irradiation, difficulty in constant, discoloration at the end, and improve cutting quality, reduce workload, and reduce discoloration. Effect

Active Publication Date: 2014-04-30
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, since the laser is repeatedly irradiated near the processing end, the laser is irradiated excessively, causing discoloration of the end portion, which poses a problem in terms of quality.
[0004] The groove width in laser processing varies depending on the set cutting conditions or the influence of the surrounding environment, so it is difficult to keep constant
Therefore, the NC program cannot be programmed to stop laser irradiation at the timing when the end material is cut off.

Method used

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  • Laser cutting machine
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Experimental program
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Embodiment approach 1

[0025] figure 1 It is a figure which shows the structure of Embodiment 1 of the laser processing machine which concerns on this invention. The laser processing machine 100 includes an NC unit 10 , a sensor data processing unit 18 , a distance sensor 19 , an X servo control unit 20 , a Y servo control unit 21 , a Z servo control unit 22 , an X servo motor 23 , a Y servo motor 24 , and a Z servo motor 25. Laser oscillator 26 and gas control device 27. The NC unit 10 includes a main control unit 13 , a processing machine control unit 14 , a position control unit 15 , and a copy control unit 17 .

[0026] The distance sensor 19 measures the distance L between the nozzle 28 and the workpiece 12 . There are various types of the distance sensor 19, and in the following description, the case of a capacitive sensor is taken as an example. However, of course, other than capacitive sensors such as optical sensors can also be used. The sensor data processing unit 18 samples sensor dat...

Embodiment approach 2

[0042] The configuration of the second embodiment of the laser processing machine according to the present invention is the same as that of the first embodiment. Figure 7 It is a flowchart which shows the operation flow at the time of inner hole processing of the laser processing machine 100 which concerns on Embodiment 2. FIG. In the operation of the present embodiment, the machining conditions are not changed in the vicinity of the machining end. That is, to become the image 3 The operations corresponding to steps S101 and S102 in the above are omitted, and the processes in steps S201 to S204 are the same as the processes in steps S103 to S106 in the first embodiment.

[0043] In the present embodiment, if the operation cycle of the sensor data processing unit 18 is shorter than the oscillation cycle in normal laser processing, even without changing the processing conditions, it is possible to quickly detect that the end material 12a is cut off. The laser oscillation is ...

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Abstract

This laser cutting machine is provided with: a main control unit (13) that executes a numerical control (NC) program; a laser oscillator (26) that oscillates a laser beam according to instructions from the main control unit (13); a distance sensor (19) that measures a distance (L) between a nozzle (28) and a workpiece (12); a sensor data processing unit (18) that samples the measurements of the distance sensor (19); and a profile control unit (17) which, on the basis of the measurements of the distance sensor (19) inputted from the sensor data processing unit (18), moves a machining head (7) in such a manner that the distance between the nozzle (28) and the workpiece (12) is kept constant. The sensor data processing unit (18) samples the measurements of the distance sensor (19) in an operating cycle that is shorter than the operating cycle of the main control unit (13), and, if a portion of a through hole in the workpiece (12) falls off during inner hole machining, causing the distance between the nozzle (28) and the workpiece (12) to become larger than a prescribed value, outputs a stop signal to the laser oscillator (26) to force the laser beam to stop oscillating.

Description

technical field [0001] The present invention relates to a laser processing machine. Background technique [0002] In the inner hole machining by laser machining, a machining start point is set on the portion cut off as the end material, and the portion that is the edge portion of the through hole is cut from the machining start point and irradiated along the edge portion. by laser. [0003] In laser processing, the cutting groove has a width even though it is thin, and a force is applied to the material to be cut by the pressure of the gas ejected from the processing nozzle, so the timing ( timing) earlier than the timing at which the nozzle reaches the end of the machining path. Therefore, since the laser beam is repeatedly irradiated in the vicinity of the processing end, the laser beam is irradiated excessively and the end portion is discolored, which is a problem in terms of quality. [0004] Since the groove width in laser processing varies depending on the cutting c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/382B23K26/00B23K26/08
CPCB23K26/0665B23K26/38B23K26/08G05B2219/45041
Inventor 井上孝
Owner MITSUBISHI ELECTRIC CORP