Substrate dividing device

A technology for breaking devices and substrates, which is applied in glass cutting devices, glass manufacturing equipment, glass production, etc., which can solve the problems of time-consuming transportation and longer working time, and achieve the effect of shortening working time

Inactive Publication Date: 2014-05-21
MITSUBOSHI DIAMOND IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is a problem that it takes a lot of time to transfer the substrate to the breaking device after inverting the substrate, and the overall work time required for breaking the substrate becomes long.

Method used

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Embodiment Construction

[0039] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the specific implementation, structure, features and effects of the substrate breaking device proposed according to the present invention will be described below in conjunction with the accompanying drawings and preferred embodiments. Details are as follows.

[0040] Hereinafter, details of the substrate cutting device of the present invention will be described based on the implementation drawings. figure 1 It is a perspective view schematically showing the overall configuration of the substrate cutting device of the present invention. figure 2 A schematic top view thereof is shown.

[0041] In the substrate breaking device shown in this embodiment, such as figure 1 , figure 2 As shown, it is composed of a conveyor (conveyer) C for loading, a scoring device D, a breaking device F, a conveying mechanism E, a suction reversing mechani...

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PUM

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Abstract

The invention discloses a substrate dividing device, comprising an etching device (D) forming etching lines on the surface of brittle material substrate (W); a conveying mechanism (E) which transmits the etched substrate (W) to an absorbing inversion mechanism (G); the absorbing inversion mechanism (G) which has an absorbing plate (29) which can be inversely rotated up and down through a rotating shaft (28), and which takes the substrate (W) from the conveying mechanism (E) and enables the substrate (W) to be inversely rotated up and down and to be placed on a platform (15) of a breaking device (F); and the breaking device (F) which breaks the substrate (W) taken from the absorbing inversion mechanism (G). The rotating shaft (28) of the absorbing plate (29) of the absorbing inversion mechanism (G) is disposed at the end part of the absorbing plate (29) in an extending manner along a direction approximately orthogonal to the conveying direction of the substrate (W). The absorbing plate (29) absorbed with the substrate (W) is inversely rotated with the rotating shaft (28) being the fulcrum. The rotating shaft (28) is disposed near the platform (15) of the breaking device (F) in a manner that the inversely-rotated substrate (W) can be disposed on the platform (15) of the breaking device.

Description

technical field [0001] The present invention relates to a substrate cutting device for a brittle material substrate such as a glass substrate, in particular to a substrate cutting device that forms a scribed line on the substrate and performs severing along the scribed line. Background technique [0002] According to prior art, such as disclosed in Patent Document 1, the following method is known: for a large-area mother substrate placed on a platform, a scribing device is used to rotate a cutter wheel (also known as a scribing wheel) , using the thermal strain generated by the irradiation of the laser beam, etc., to form a plurality of parallel scribe lines orthogonal to each other, and then reverse the mother substrate by the suction inversion mechanism and place it on the platform of the breaking device, from The surface opposite to the surface provided with the scribe line is pressed by the breaking bar to bend the substrate, thereby breaking the substrate and taking out...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03B33/02
CPCC03B33/027C03B33/03C03B33/033C03B33/037Y02P40/57
Inventor 成尾彻
Owner MITSUBOSHI DIAMOND IND CO LTD
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