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Method of inspecting lead of electric device

A technology of electronic components and inspection methods, which is applied in image data processing, optical device exploration, instruments, etc., can solve the problems of inability to accurately check the existence of lead wires, interference, etc., and achieve the effect of improving satisfaction and reliability

Inactive Publication Date: 2014-05-21
KOHYOUNG TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, this usual method for checking the presence of lead wires only uses the color of the image to check whether the respective lead wires exist. However, due to the surrounding area of ​​the lead wires, the image color of the part where the lead wires are located often interferes (noise), so that the lead wires cannot be accurately checked. does it exist

Method used

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  • Method of inspecting lead of electric device
  • Method of inspecting lead of electric device
  • Method of inspecting lead of electric device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] figure 1 is a side view showing the state where the leads are bonded to the printed circuit board, figure 2 It is a block diagram for explaining the lead inspection method of the electronic component according to the first embodiment of the present invention.

[0043] refer to Figure 1 to Figure 2 The lead wire inspection method of an electronic component according to the first embodiment of the present invention relates to a method for judging the presence or absence of individual lead wires 100 of the above-mentioned electronic component, by measuring the height value of the attention area of ​​each lead wire 100, it is ensured that the individual lead wires can be distinguished The presence or absence of 100 makes it possible to more accurately determine the presence or absence of individual leads 100 without being limited to the surrounding area of ​​the above-mentioned leads 100 at all.

[0044] In order to inspect the lead wire 100 using the lead wire inspecti...

Embodiment 2

[0055] Figure 4 is a block diagram for explaining a lead wire inspection method of an electronic component according to a second embodiment of the present invention.

[0056] The lead wire inspection method according to this embodiment is the same as the lead wire inspection method according to the first embodiment, except for the step of discriminating the presence or absence of individual lead wires 100 using the height value of the region of interest of the lead wire 100 described above (S230), Therefore, detailed descriptions of steps other than the step ( S230 ) of determining the presence or absence of the individual lead wire 100 using the height value of the region of interest of the lead wire 100 described above will be omitted.

[0057] The wire inspection method according to this embodiment is also a method for judging whether an individual wire 100 exists. Preferably, the shoulder area 110 of the wire 100 is the attention area of ​​the wire 100 .

[0058] refer t...

Embodiment 3

[0062] Figure 5 is a block diagram for explaining a lead wire inspection method of an electronic component according to a third embodiment of the present invention.

[0063] The lead wire inspection method according to the present embodiment is similar to the lead wire inspection method according to the second embodiment except for the step of judging whether the individual lead wire 100 is warped or not (S330) by using the height value of the region of interest and the region of interest of the lead wire 100 described above. The inspection method is the same, so detailed descriptions of other steps except the step of judging whether the individual lead 100 is warped or not ( S330 ) using the region of interest and the height value of the region of interest of the lead 100 will be omitted.

[0064] The lead wire inspection method according to the present embodiment is a method for judging whether an individual lead wire 100 is warped or not. Preferably, the tip region 120 of ...

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Abstract

A method of inspecting leads of an electric device, which is capable of improve reliability of inspection regardless of noises induced by regions near the lead. The method uses a height or a brightness of a shoulder region of the lead to inspect existence or nonexistence or a height or a brightness of a tip region of the lead to inspect fastening or unfastening. Therefore, reliability of inspection is improved in comparison with a conventional inspection using colors of lead region.

Description

technical field [0001] The present invention relates to a lead inspection method of an electronic component, and more specifically, to a lead inspection method of an electronic component mounted on a printed circuit board (PCB: printed circuit board). Background technique [0002] Generally, a printed circuit board is mounted with a plurality of electronic components having a plurality of leads formed on their bodies, and the leads are bonded to the printed circuit board by solder joints. [0003] In order to check whether the above-mentioned electronic components are normally assembled on the above-mentioned printed circuit board, it is generally judged whether there are respective leads bonded by solder joints on the above-mentioned printed circuit board, so as to judge whether it is qualified or not. [0004] As a general method for judging whether or not there are individual leads assembled on the above-mentioned printed circuit board, after acquiring an image around the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01V8/10G01N21/88G01B11/02
CPCG06T7/0006G06T7/0008G06T2207/30152G01B11/24G01N21/8806
Inventor 郑仲基
Owner KOHYOUNG TECH