A kind of support device of semiconductor wafer

Abstract

The invention discloses a support device of a semiconductor wafer. The support device of the semiconductor wafer comprises an annular support ring and a plurality of supporting legs, wherein the annular support ring is mounted at the upper end of a wafer storage table in a wafer transferring system of semiconductor process equipment, and the supporting legs are mounted on the circumference of the support ring for supporting the wafer. Each supporting leg is L-shaped, a wafer support surface is mounted at the upper end of the vertical part of the L shape, the horizontal part of the L shape is connected with the support ring, and the supporting leg is connected with the support ring in the mode that the vertical part of the L shape is located at the outer side and the horizontal part is located at the inner side. The support ring of the support device of the semiconductor wafer is reduced in volume, and accordingly the floor space of the equipment is reduced, the wafer is avoided from breaking due to falling to the ground from the inner diameter of the support ring, the wafer is easier to put stably, the damage caused by friction and the particle generation are reduced, and the support device of the semiconductor wafer is applicable to be popularized in factories.

Description

technical field [0001] The present invention relates to a wafer storage table in a semiconductor process equipment wafer transfer system, and more particularly, to a wafer support device for a wafer storage table in a semiconductor process equipment wafer transfer system. Background technique [0002] Semiconductor manufacturing is a series of cycles and repetitions of major process steps. Many fabrication processes involve chemical reactions that take place within the process chamber of semiconductor process equipment. Today, the processing of semiconductor wafers usually involves chemical reactions that take place in process chambers. [0003] According to different processing processes, wafers often need to be transported between process chambers of multiple semiconductor process equipment through a wafer transfer system. In the process equipment, the main function of the wafer transfer system is to load the wafers, and all loading and unloading are done by automatic ma...

AI Technical Summary

Problems solved by technology

Although the design form of this device can easily meet the hand space of the manipulator by adjusting the position of the supporting feet on the circumference of the supporting ring, so as to facilitate the operation of the manipulator, there are also obvious problems at the same time: this supporting foot device is due to the wafer support of the supporting feet. The support surface is located at the front end of the support leg, and the assembly position with the support ring is located at the rear end of the support leg, so that the inner diameter of the support ring is larger than the outer diameter of the wafer, and the outer diameter of the support ring exposes a lot of the outer diameter of the wafer

Moreover, the structure of the support ring of the device is also relatively complicated, which greatly increases the difficulty of processing and increases the cost of equipment.

Images