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A Substrate Processing Method for Improving Accuracy or Consistency of Emission Compensation Temperature Measurement

A processing method and consistent technology, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve problems such as lack of consistency and reproducibility, inaccurate temperature calculation, "pattern recognition" errors, etc., to improve the accuracy of temperature measurement Sex, enhance the effect of reflected signal

Active Publication Date: 2017-04-12
TONGFANG OPTO ELECTRONICS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This will cause "pattern recognition" errors of the test software or inaccurate temperature calculations, lack of consistency and reproducibility

Method used

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  • A Substrate Processing Method for Improving Accuracy or Consistency of Emission Compensation Temperature Measurement
  • A Substrate Processing Method for Improving Accuracy or Consistency of Emission Compensation Temperature Measurement
  • A Substrate Processing Method for Improving Accuracy or Consistency of Emission Compensation Temperature Measurement

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Embodiment Construction

[0023] see figure 2 and image 3 , the steps of the processing method of the present invention are as follows: for a substrate with a transparent wavelength of detection light, the flat substrate is subjected to double-sided polishing; then the front of the flat substrate is subjected to a dry etching process to make a pyramid-shaped figure to form a patterned substrate, The surface of the front pattern of the patterned substrate is flattened and smoothed, and the uniformity of the geometric characteristics of the pattern structure is maintained, and the back of the patterned substrate is polished. For the non-transparent substrate of the detection light wavelength, only the front side of the flat substrate is polished; then the front side of the flat substrate is subjected to a dry etching process to make a pyramid-shaped pattern to form a patterned substrate, and the front side of the patterned substrate is patterned The surface is smoothed and smoothed, and the uniformity...

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Abstract

The invention discloses a substrate processing method for improving emission compensation temperature measurement accuracy or consistency, and relates to the technical field of LED material engineering. The method comprises the following steps: for a substrate whose probe light wavelength is transparent, performing double-face polishing processing on a flat substrate, performing flattening and smooth processing on the surface of the front pattern of a graphical substrate, maintaining homogeneity of geometrical characteristics of a figure structure, and performing polishing processing again on the back surface of the graphical substrate; and for a substrate whose probe light wavelength is nontransparent, only performing front-surface polishing processing on a flat substrate, performing flattening and smooth processing on the surface of the front pattern of a graphical substrate, and maintaining homogeneity of geometrical characteristics of a figure structure, the flexibility, angularity and aggregate thickness of the processed flat substrates or graphical substrates being smaller than 15 micrometers. According to the invention, through processing the flat substrates or the surfaces of the graphical substrates, the substrate surface uniformity is improved, and the test precision is improved.

Description

technical field [0001] The invention relates to the technical field of LED material engineering, in particular to a method for processing substrates used in LED epitaxial material growth equipment that can improve the accuracy or consistency of emission compensation temperature measurement methods. Background technique [0002] Metal-Organic Chemical Vapor Deposition (MOCVD) equipment or technology is currently a method widely used in the industry to manufacture compound semiconductors. It can epitaxially produce single crystals covering group III-V compounds, such as nitrides, phosphides, arsenides, etc., and group II-VI compounds, such as oxides and sulfides, on certain substrate materials. Most of these materials are wide-bandgap semiconductors, which have a variety of uses in the electronics and optoelectronics industries. For example, the above materials are used to manufacture light-emitting diodes, laser diodes, photodiodes, solar photovoltaic cells, field-effect tran...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00
CPCH01L33/005H01L33/10
Inventor 马亮梁信伟
Owner TONGFANG OPTO ELECTRONICS
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