Polyamic acid resin composition, polyimide resin composition, polyimide oxazole resin composition, and flexible substrate containing same

A technology of polyamic acid resin and polyimide resin, applied in the field of flexible substrates, can solve the problems of high transparency and low birefringence, and achieve low birefringence, high light transmittance, and excellent heat resistance. Effect

Active Publication Date: 2014-06-04
TORAY IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, there is a problem that it cannot be used as a displa

Method used

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  • Polyamic acid resin composition, polyimide resin composition, polyimide oxazole resin composition, and flexible substrate containing same
  • Polyamic acid resin composition, polyimide resin composition, polyimide oxazole resin composition, and flexible substrate containing same
  • Polyamic acid resin composition, polyimide resin composition, polyimide oxazole resin composition, and flexible substrate containing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0182] PMDA-HH 2.7704 g (12 mmol), HFHA 7.4706 g (12 mmol), and NMP 50 g were added to a 100 mL 4-necked flask under a dry nitrogen stream, and heated and stirred at 80°C. After 8 hours, cool to form a varnish.

Embodiment 2

[0184] PMDA-HS2.7704g (12mmol), HFHA7.4706g (12mmol), and NMP50g were added to a 100mL 4-necked flask under dry nitrogen flow, and it heated and stirred at 80 degreeC. After 8 hours, cool to form a varnish.

Embodiment 3

[0186] 3.4441 g (11 mmol) of BPDA-H, 6.7969 g (11 mmol) of HFHA, and 50 g of NMP were added to a 100 mL four-neck flask under a dry nitrogen flow, and heated and stirred at 80°C. After 8 hours, cool to form a varnish.

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Abstract

Provided are: a polyamic acid resin composition, polyimide resin composition, and polyimide oxazole resin composition of which a post-heat-treatment film has superior heat resistance, transparency, and low birefringence; and a flexible substrate containing same. The polyamic acid resin composition is characterized by containing: (a) a polyamic acid having as the primary component the structural unit represented in general formula (1); and (b) a solvent. (In general formula (1): X1 and X2 each independently represent a hydrogen atom or a monovalent organic group having 1-10 carbon atoms; R1 represents a tetravalent organic group having 4-40 carbon atoms having an alicyclic structure that is a monocycle or a fused polycycle, or a tetravalent organic group having 4-40 carbon atoms wherein organic groups having a monocyclic alicyclic structure are bonded to each other directly or with a cross-linking structure therebetween; and R2 represents a divalent organic group having 2-40 carbon atoms and having at least two hydroxyl groups.)

Description

technical field [0001] The present invention relates to a polyamic acid resin composition, a polyimide resin composition, and a polyimide oxazole resin composition, and a flexible substrate containing them. More specifically, it relates to polyamic acid resin compositions and polyimide resin compositions that can be favorably used in flexible substrates such as flat panel displays, touch panels, electronic paper, color filter substrates, solar cells, and flexible printed substrates. and polyimide Azole resin compositions and flexible substrates containing them. Background technique [0002] Compared with glass, organic film is flexible, unbreakable, and light in weight. Recently, research on making displays more flexible by replacing the substrates of flat panel displays with organic films has become more active. [0003] When producing a display on an organic film, the following steps are generally performed: forming an organic film on a support substrate, producing a d...

Claims

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Application Information

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IPC IPC(8): C08G73/10H05K1/03
CPCH05K2201/0154C08G73/22H05K1/0346H05K1/0393H05K2201/0108C08G73/10
Inventor 胁田润史宫崎大地三好一登富川真佐夫
Owner TORAY IND INC
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