A kind of preparation method of polyvinylidene fluoride piezoelectric film
A polyvinylidene fluoride piezoelectric and polyvinylidene fluoride technology, which is applied in the manufacture/assembly of piezoelectric/electrostrictive devices, etc. Problems such as the inability to continuously process large-area polyvinylidene fluoride piezoelectric films
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[0020] The preparation of polyvinylidene fluoride piezoelectric film, according to the following steps:
[0021] a configuration of polyvinylidene fluoride solution
[0022] Dissolving polyvinylidene fluoride powder into a solvent, stirring at room temperature for 3 hours to 8 hours, to obtain a polyvinylidene fluoride solution with a concentration percentage of 1 wt% to 15 wt%, and the solvent is N,N-dimethylformamide or Either dimethylacetamide or dimethylsulfoxide.
[0023] b Preparation of the mold assembly
[0024] Described mold device is made up of mold (2), lower conductive plate (1), upper conductive plate (4), lower electrode wire (5), upper electrode wire (6) and DC power supply (7), and mold ( 2) It is an insulating flat plate with a shallow groove of 1mm-3mm deep, and a lower conductive electrode plate (1) with the same area as the shallow groove is placed on the bottom surface of the shallow groove, and the thickness of the lower conductive electrode plate (1) ...
Embodiment 1
[0031] a configuration of polyvinylidene fluoride solution
[0032] The polyvinylidene fluoride powder was dissolved in a solvent, and stirred at room temperature for 3 hours to obtain a polyvinylidene fluoride solution with a concentration of 1 wt %, and the solvent was N,N-dimethylformamide.
[0033] b Preparation of the mold assembly
[0034] Described mold device is made up of mold (2), lower conductive plate (1), upper conductive plate (4), lower electrode wire (5), upper electrode wire (6) and DC power supply (7), and mold ( 2) It is an insulating flat plate with a 1mm deep shallow groove, and a lower conductive electrode plate (1) with the same area as the shallow groove is placed on the bottom surface of the shallow groove, and the thickness of the lower conductive electrode plate (1) is 0.1mm. The lower conductive electrode plate (1) is led outside the mold (2) through the lower electrode wire (5), and an upper conductive electrode plate (4) of equal area is fixedly in...
Embodiment 2
[0038] a configuration of polyvinylidene fluoride solution
[0039] The polyvinylidene fluoride powder was dissolved in a solvent, and stirred at room temperature for 3 hours to obtain a polyvinylidene fluoride solution with a concentration of 5 wt %, and the solvent was dimethylacetamide.
[0040] b Preparation of the mold assembly
[0041] Described mold device is made up of mold (2), lower conductive plate (1), upper conductive plate (4), lower electrode wire (5), upper electrode wire (6) and DC power supply (7), and mold ( 2) It is an insulating flat plate with a 2mm deep shallow groove, and a lower conductive electrode plate (1) with the same area as the shallow groove is placed on the bottom surface of the shallow groove, and the thickness of the lower conductive electrode plate (1) is 0.2mm. The lower conductive electrode plate (1) is led outside the mold (2) through the lower electrode wire (5), and an upper conductive electrode plate (4) of equal area is fixedly inst...
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Abstract
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