A glue-covered crystal-bonding equipment

Abstract

The invention discloses a glue-coated crystal-bonding device, comprising: a wafer plate, used for placing crystal grains to be solidified; Provide the die-bonding position for the die; the die-bonding arm is used to pick up the die, and send the die to the glue tray station through the die-bonding arm for glue processing, and then pass through the die-bonding arm Bonding the glue-treated crystal grains to the positions to be solidified on the carrier. A single robotic arm is used to complete a process (including picking up crystals, taking glue, and bonding crystals), which solves the problems of timing and structural space in traditional processes, and greatly improves equipment production capacity by adding work units. At the same time, the most important thing is to solve traditional processes. The height-to-diameter ratio of each dispensing glue, the interaction between dispensing accuracy and die-bonding accuracy, poor consistency of glue dot shape, thickness, and size, and difficult control of thickness, causing problems such as blind spots or poor firmness on the bonding surface.

Description

technical field [0001] The invention relates to the field of semiconductor precision manufacturing and equipment, in particular to a glue-covered die-bonding equipment for IC and LED semiconductor packaging. Background technique [0002] Die bonder (or chip bonder) is a high-precision automatic packaging equipment that bonds chips and carriers to form thermal or electrical paths. In view of the limitations of the traditional die-bonding process, the current international leading semiconductor packaging manufacturers still use the traditional glue dispensing and die-bonding mechanism to execute the process successively to bond the chip to the target area, so that a thermal path or an electrical path is formed between the chip and the carrier. Therefore, equipment packaging manufacturers also continuously improve the structure, control, and drive of the die-bonding equipment based on this process. However, after years of hard work, the speed of the die-bonding equipment based ...

AI Technical Summary

Problems solved by technology

[0005] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a glue-covered die-bonding equipment, which uses a single mechanical arm to complete a process (including picking up crystals, taking glue and die-bonding), which solves the traditional process timing and structural space. The problem is to increase the production capacity of the equipment by increasing the number of working units. At the same time, the most important thing is to solve the problem of the height-to-diameter ratio of each glue output in the traditional process, the interactive influence of dispensing accuracy and die-fixing accuracy, and the glue’s fastness and shape are not good. Control and other issues

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