Method and apparatus for bonding workpieces

Abstract

The invention provides a method and an apparatus for bonding workpieces, which suppresses workpiece deformation and adhesive solidification contraction and simultaneously causes the adhesive to solidify integrally and formally. The apparatus for bonding the workpiece according to the invention causes one part of the adhesive (3) clamped between the overlapped workpiece (1,2) to partially and temporarily solidify and the workpieces (1,2). Afterwards, the adhesive (3) is integrally divided into a plurality of areas and partial formal solidification occur on divided areas (3b,3c,3d) in multiple times successively. Therefore, even total area of integer of the adhesive (3) is large, the parts which are divided into a plurality of narrow areas are respectively and successively solidified. Therefore, compared with a method of formally solidifying integer of large-area adhesive in one time, the method provided by the invention is advantageous in that temperature increase amount of the workpieces (1,2) in each time of formal solidification and solidification contraction amount of the divided areas (3b,3c,3d) in the adhesive (3) are greatly reduced.

Description

technical field [0001] The present invention relates to a method for bonding a plate-shaped workpiece such as a FDP such as a flat panel display (FPD) or a touch panel or a 3D (3-dimensional) display or an electronic book to another plate-shaped workpiece such as a protective glass or an FPD with an adhesive. A workpiece bonding method for workpieces and a workpiece bonding device for implementing the method. Background technique [0002] Conventionally, such a workpiece bonding method and workpiece bonding device are known in which an adhesive (UV curable resin) is supplied to one side of at least one workpiece so that the adhesive spreads over the entire surface, and then the bonding agent is applied Bond another workpiece on the adhesive, and then irradiate the outer edge of the adhesive that spreads over at least one surface of the bonded pair of workpieces with electromagnetic waves (UV light) for temporary curing, thereby only The outer edge of the adhesive forms a te...

AI Technical Summary

Problems solved by technology

[0009] However, in the aforementioned conventional workpiece bonding method, a part of the adhesive (UV curable resin) is temporarily cured by UV irradiation, and then the entire large area of ​​the adhesive is fully cured by UV irradiation. As in recent years, the structural strength of the workpiece itself has decreased, and the temperature of the entire workpiece has risen due to the energy imparted by UV irradiation for the main curing of the entire large-area adhesive, and the large-area adhesive has curing shrinkage, etc. Deformation such as warping or distortion occurs, and position deviation occurs between temporarily fixed workpieces

[0010] Therefore, there is a problem that the workpieces cannot be positioned with high precision, and the yield rate decreases.

[0011] In particular, when bonding a display panel with a circuit board connected by sandwiching a flexible board (FPC) from one side of the workpiece, the thickness of the adhesive (UV curable resin) at the place where the flexible board is inserted becomes thicker than that of the other The thickness of the adhesive is thick, so even if the multiple parts of the adhesive are temporarily cured by UV irradiation in the form of dots while the overlapping positions of the workpieces are determined, the UV irradiation for the main curing is compared to the entire adhesive. The energy applied to a large area makes the point-like temporary solidification position become a fulcrum and the entire workpiece becomes easily deformed, and the temporarily fixed workpieces are shifted to the other side, etc., and the required positioning accuracy of the workpieces cannot be achieved.

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