Conductive adhesive, solar cell module using same, and method for manufacturing solar cell module
A solar cell and conductivity technology, applied in the direction of conductive adhesives, conductive materials dispersed in non-conductive inorganic materials, non-polymer adhesive additives, etc., can solve the problem of power generation efficiency that has not been discussed, and has not been studied Excellent adhesion and connection reliability
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manufacture example 1
[0172]
[0173] As the copper powder, what was obtained by mechanically pulverizing the atomized copper powder obtained by the manufacturing method called the atomization method was used. In addition, at the time of mechanical stirring, it is presumed that fatty acid is added for the purpose of preventing coarsening due to aggregation of copper powders. Specifically, flaky copper powder (AFS-Cu7 μm) manufactured by Nippon Artemis Processing Co., Ltd. was used. The weight cumulative particle diameter D obtained by the copper powder by laser diffraction scattering particle size distribution measurement method 50 is 7.9 μm.
[0174] 500 g of this flaky copper powder was heat-treated at 250° C. for 5 minutes in the air (oxidation treatment). After that, the oxidized copper powder was put into a mortar and coarsely pulverized. 500 g of this copper powder was added to 1,000 mL of a 1% by mass potassium hydroxide aqueous solution and stirred for 20 minutes. Then, the first decan...
Embodiment 1
[0183]
[0184] -Production of conductive adhesive film-
[0185] 25 parts by mass of phenoxy resin (PKHH, manufactured by InChem Co., Ltd.), 45 parts by mass of acrylate resin (NK Ester A-IB, manufactured by Shin Nakamura Chemical Co., Ltd.), acrylic rubber (Techisan Resin SGP3, manufactured by Nagase Sangyo Co., Ltd.) ) 10 parts by mass, isoprene-styrene copolymer (Septon 1001, manufactured by Kuraray Co., Ltd.) 15 parts by mass, curing agent (Naiper BW, manufactured by NOF Corporation, organic peroxide) 5 parts by mass, conductive 5 parts by mass of conductive particles (silver-coated copper powder obtained in Production Example 1, with an average particle diameter of 10 μm) and 0.1 parts by mass of titanium black 1 (13MT, manufactured by Mitsubishi Materials Corporation, with an average particle diameter of 80 nm) were mixed to prepare a conductive adhesive. Connect the composition.
[0186] Next, the obtained conductive adhesive composition was applied on a polyethylen...
Embodiment 2~8
[0240] The conductive adhesive film and solar energy battery module.
[0241] The same evaluation as in Example 1 was provided. Table 1 shows the results.
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