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High-power IGBT module soldering device

A welding device and high-power technology, applied in auxiliary devices, welding equipment, metal processing, etc., can solve problems such as welding failure, easy change of relative position, and unguaranteed welding quality, so as to improve efficiency, improve service life, and product reliability high effect

Inactive Publication Date: 2014-07-02
ZHUZHOU CSR TIMES ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, during soldering, there is no adhesion between components, soldering material and substrate, and the relative position is easy to change during assembly and welding, resulting in welding failure or welding quality cannot be guaranteed

Method used

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  • High-power IGBT module soldering device
  • High-power IGBT module soldering device
  • High-power IGBT module soldering device

Examples

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Embodiment Construction

[0023] It should be noted that, in the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and examples. For the convenience of description, if the words "up", "down", "left" and "right" appear in the following, it only means that the directions of up, down, left and right are consistent with the drawings themselves, and do not limit the structure.

[0024] Such as Figure 1-5 As shown, a high-power IGBT module welding device includes a soldering tab fixing tool 3, a liner plate fixing tool 6 and a positioning pin 2; the soldering tab fixing tool 3 and the soldering tab 4 have the same thickness, and are provided with a fixed soldering 4; the thickness of the lining plate fixing tool 6 is consistent with that of the lining plate 5 to be welded, and a through groove for fixing the lining plate 5 to be...

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PUM

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Abstract

The invention provides a high-power IGBT module soldering device. The soldering device comprises a soldering lug fixing tool, a liner plate fixing tool and a positioning pin, wherein the soldering lug is consistent with a soldering lug in thickness and provided with a through groove for fixing the soldering lug; a through groove for fixing the liner plate to be welded is formed in the liner plate fixing tool; a through groove used for fixing a liner plate to be welded is formed in the liner plate fixing tool; the soldering lug fixing tool and the liner plate fixing tool are respectively provided with a positioning hole corresponding to the positioning pin. Formed sheet soldering flux (soldering lug) without scaling powder is adopted and put in the specific tool, so that positions of an area to be soldered, the sheet material and a liner plate element to be soldered are fixed to solder an IGBT module through the soldering lug; after soldering, it is unnecessary to clean a soldered product because no scaling powder exists, and therefore not only can module assembly efficiency be improved, but also product reliability can be improved.

Description

technical field [0001] The invention relates to the field of electronic components, in particular to a high-power IGBT module welding device. Background technique [0002] At present, when power modules are packaged, solder paste is usually used to solder the substrate. First, the cream solder is applied to the base to be welded, and then the components to be soldered (with a backing board) are placed on the cream solder. Put the assembled base and liner into the soldering furnace to solder the product, but the solder paste contains a lot of flux, and the residual flux after soldering and cleaning will reduce the reliability of the module. For high-reliability large For power IGBTs (Insulated Gate Bipolar Transistor), due to the large soldering area, a large amount of solder paste needs to be used. After the soldering is completed, a large amount of flux will remain on the surface of the components and the inner wall of the soldering equipment. Use water to clean It is diff...

Claims

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Application Information

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IPC IPC(8): B23K3/00B23K3/08
CPCB23K3/087B23K1/008B23K2101/18B23K2101/36
Inventor 曾雄张泉李继鲁彭勇殿吴煜东常桂钦
Owner ZHUZHOU CSR TIMES ELECTRIC CO LTD
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