Array substrate, display device and manufacturing method of array substrate
A technology of an array substrate and a manufacturing method, applied in the display field, can solve the problems of uneven electric field, burrs and delamination of data lines 13, large voltage difference, etc.
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Embodiment 1
[0039] An embodiment of the present invention provides an array substrate, including a substrate, a data line formed on the substrate, a transparent conductive film covering the data line, at least one thin film transistor formed on the substrate, and a pixel electrode formed on the substrate . The thin film transistor includes a source electrode and a drain electrode, and the drain electrode is electrically connected to the data line. Optionally, the pixel electrode covers the source electrode and is electrically connected to the source electrode, the transparent conductive film directly covers the data line, and the above-mentioned substrate may be, but not limited to, a glass substrate.
[0040] It should be noted that, the transparent conductive film in the embodiment of the present invention may cover the data line, and may also partially cover the data line, which is not limited in the present invention.
[0041] like image 3 (other devices are not shown), which is a ...
Embodiment 2
[0048] The following is as image 3 and Figure 4 The manufacturing method of the shown array substrate is introduced in detail.
[0049] like Figure 5 As shown, it is a schematic flowchart of a manufacturing method of an array substrate provided in Embodiment 2 of the present invention, including the following steps:
[0050] Step 101 : forming a metal layer on the substrate 6 .
[0051] The substrate 6 may be, but not limited to, a glass substrate. Optionally, before the metal layer is formed on the substrate 6, the scan line and the active layer, and the insulating layer or passivation layer between the layers can be formed on the substrate 6, and then the metal layer is formed on the active layer. , of course, between the active layer and the metal layer, there may be a passivation layer or an insulating layer, which is not limited by the solution of the embodiment of the present invention.
[0052] This step 101 is the same as the implementation process of forming a...
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